高速光模块印制板金手指露铜问题研究  

Research on copper exposure of gold finger in high speed optical module printed board

作　　者：龙光泽 王立刚 万应琪 Long guangze;Wang Ligang;Wan yingqi

机构地区：[1]深圳市强达电路股份有限公司,广东深圳518000 [2]江西强达电路科技有限公司,江西赣州341000

出　　处：《印制电路资讯》2023年第6期96-100,共5页Printed Circuit Board Information

摘　　要：随着产品的应用环境越来越复杂,而金手指部分长期裸露在外部环境中,因此,部分应用端客户针对光模块PCB产品除了要求印制插头表面镀层有良好的耐磨性之外,还要求具有较好的可靠性,以确保产品在使用过程中有良好的传输速率。为了满足这些品质要求,插头的表面处理方式一般选用电镀铜镍金(厚金)、化学镍金+电厚金、化学镍钯金等工艺[1],印制电路板过程中常见金手指星点露铜和凹陷会影响电信号的正常传输。本文针对印制PCB金手指露铜进行系列验证改善,满足客户需求。As the application environment of the product becomes more and more complex,and the goldfinger part is exposed to the external environment for a long time,therefore,some application customers for optical module PCB products in addition to requiring the printed plug surface coating to have good wear resistance,but also require better reliability to ensure that the product has a good transmission rate during use process.In order to meet these quality requirements,the surface treatment method of the plug is generally selected by electroplating copper nickel gold(thick gold),chemical nickel gold+electroplating thick gold[1],chemical nickel palladium gold and other processes.the common gold finger copper spot and dent in the printed circuit board process will affect the normal transmission of electro-optical signals.this paper,a series of verification and improvement PCB gold finger copper is carried out to meet customer needs.

关 键 词：PCB 高速光模块 金手指 金手指露铜 

分 类 号：TN4[电子电信—微电子学与固体电子学]