研磨SiCp/Al复合材料微弧氧化膜的有限元仿真研究  

FEA Simulation Study on the Grinding of Process Parameters on SiCp/Al Composites Micro Arc Oxidation Film

作　　者：王政棋 于晓琳[1] 黄树涛[1] 许立福[1] 张玉璞[1] 刘成炜 WANG Zhengqi;YU Xiaolin;HUANG Shutao;XU Lifu;ZHANG Yupu;LIU Chengwei(School of Mechanical Engineering,Shenyang Ligong University,Shenyang 110159,China)

机构地区：[1]沈阳理工大学机械工程学院,沈阳110159

出　　处：《机械工程师》2023年第12期33-36,共4页Mechanical Engineer

基　　金：辽宁省特聘教授资助课题。

摘　　要：SiCp/al复合材料两相性能差异大,研磨缺陷多,通过表面微弧氧化,生成硬脆的陶瓷氧化膜,建立两相延性耦合去除的研磨条件,故基于ABAQUS有限元仿真软件,建立单磨粒研磨SiCp/Al复合材料微弧氧化膜的三维模型并进行仿真实验,得到了陶瓷膜在材料去除过程中的表面应力变化规律,通过改变研磨加工工艺参数,得到不同工艺参数与切削力的关系,仿真结果表明:当其他条件一定时,研磨速度越快,磨粒切削力越小;研磨压力越大,磨粒切削力越大;磨粒越大,磨粒切削力越大。Two-phase properties of SiCp/Al composites are quite different,and there are many grinding defects.Hard and brittle ceramic oxide film is formed by micro-arc oxidation on the surface,and the grinding conditions of two-phase ductile coupling removal are established.Based on ABAQUS finite element simulation software,this paper establishes a three-dimensional model of grinding micro-arc oxidation film of SiCp/Al composites with single abrasive particle,and carries out simulation experiments.The variation law of surface stress of ceramic film during material removal is obtained.By changing grinding process parameters,the relationship between different process parameters and cutting force is obtained.The simulation results show that when other conditions are certain,the faster the grinding speed is,the smaller the abrasive cutting force is.The greater the grinding pressure,the greater the cutting force of abrasive particles.The larger the abrasive grain,the greater the cutting force of abrasive grain.

关 键 词：单磨粒 研磨 SICP/AL复合材料 陶瓷 工艺参数 有限元仿真 

分 类 号：TB333[一般工业技术—材料科学与工程]