Sn-3Ag-0.5Cu合金与金属Cu的润湿性研究  

Research on Wettability of Sn-3Ag-0.5Cu Alloy on Metal Cu

作　　者：刘亚光 陈磊 胥晓晨 张波 LIU Yaguang;CHEN Lei;XU Xiaochen;ZHANG Bo(Academy of Materials Science and Engineering,Shenyang Aerospace University,Shenyang 110136,China)

机构地区：[1]沈阳航空航天大学材料科学与工程学院

出　　处：《热加工工艺》2023年第17期41-43,共3页Hot Working Technology

摘　　要：研究了加热温度、保温时间对Sn-3Ag-0.5Cu合金钎料在金属Cu基板上的润湿性和界面反应的影响。结果表明:保温时间为60 min,随加热温度在275~350℃增大,Sn-3Ag-0.5Cu钎料的平衡润湿角从56.0°降至28.1°;该润湿属于反应润湿,在界面形成Cu_(3)Sn相和Cu_(6)Sn_(5)相。随着加热温度的增加、保温时间的延长,Cu元素逐渐向Sn-3Ag-0.5Cu合金中扩散,两相厚度逐渐增加且更加均匀。The effects of heating temperature and holding time on the wettability of Sn-3Ag-0.5Cu solder on Cu substrate and interfacial reaction were studied.The results show that when the holding time is 60 min,with the increase of heating temperature from 275℃ to 350℃,the stable wetting angle of Sn-3Ag-0.5Cu solder drops from 56.0% to 28.1°.It belongs to reaction wetting,Cu_(3Sn) and Cu_6Sn_(5) phases are formed at the interface.With the increase of heating temperature and holding time,Cu element gradually diffuses to Sn-3Ag-0.5Cu alloy,and the thickness of the two phases gradually increases and becomes more uniform.

关 键 词：Sn-3Ag-0.5Cu合金钎料 Cu基板 润湿角 界面反应 

分 类 号：TG425.1[金属学及工艺—焊接]