相干光收发器件未来技术演进  

Future Technology Evolution of Coherent Transceiver Optical Devices

作　　者：沈百林 王会涛 SHEN Bailin;WANG Huitao(ZTE Photonics Technology Co.,Ltd,Nanjing 210012,China)

机构地区：[1]中兴光电子技术有限公司,中国南京210012

出　　处：《中兴通讯技术》2023年第5期82-86,共5页ZTE Technology Journal

摘　　要：相干光收发器件是相干光通信系统的核心器件。相干光通信系统朝着更大容量、更长传输距离、更低成本方向发展,同时相干光收发器件面临一系列新挑战,包括高带宽、多波段、高性能、高可靠性、高集成度、低功耗。相干光收发器件的未来技术演进包括新材料光芯片、先进封装技术、多路集成架构等方面。光芯片将存在多种材料,包括硅光、磷化铟和薄膜铌酸锂,以及基于硅光平台的异质集成技术。光器件将参考采用微电子行业的先进封装技术,以减小芯片间高速电信号的传输距离,降低成本,保证封装可靠性。器件级多路集成可满足未来多波传输架构的需求。Coherent transceiver optical devices are the key devices of coherent optical communication systems.With the development of co⁃herent optical communication systems towards larger capacity,longer transmission distance,and lower cost,coherent transceiver optical de⁃vices face a series of new requirements and challenges,including high bandwidth,wide spectral band,high performance,high reliability,high integration,and low power consumption.Future technology evolution of coherent transceiver optical devices includes:new material op⁃tical chips,advanced packaging technologies,and multi-channel integrated architectures.A variety of materials will exist in optical chips,in⁃cluding silicon photonics,indium phosphide and thin-film lithium niobate,as well as heterogeneous integration technologies based on sili⁃con photonics platforms.The optical device will refer to the advanced packaging technology of the microelectronics industry to reduce the high-speed electrical signal transmission distance between chips,and ensure package reliability.The device-level multi-lane integration meets the needs of future multi-wavelength transmission architectures.

关 键 词：相干通信 光器件 技术演进 

分 类 号：TN929.1[电子电信—通信与信息系统]