微电子封装用低温固化型光敏聚酰亚胺的研究与应用进展  

Progress on the research and application of low-temperature curable photosensitive polyimides for microelectronic packaging

作　　者：任茜 何志斌 高艳爽 王振中 韩淑军 齐悦新 职欣心 于海峰[2] 刘金刚[1] REN Xi;HE Zhi-bin;GAO Yan-shuang;WANG Zhen-zhong;HAN Shu-jun;QI Yue-xin;ZHI Xin-xin;YU Hai-feng;LIU Jin-gang(Engineering Research Center of Ministry of Education for Geological Carbon Storage and Low Carbon Utilization of Resources,School of Materials Science and Technology,China University of Geosciences,Beijing 100083,China;School of Material Science and Engineering,Key Laboratory of Polymer Chemistry and Physics of Ministry of Education,Peking University,Beijing 100871,China)

机构地区：[1]中国地质大学(北京)材料科学与工程学院,地质碳储与资源低碳利用教育部工程研究中心,北京100083 [2]北京大学材料科学与工程学院,教育部高分子化学与物理重点实验室,北京100871

出　　处：《精细与专用化学品》2023年第12期11-21,共11页Fine and Specialty Chemicals

基　　金：深圳市科技计划项目(技术攻关重点项目)(JSGG20210629144539012)。

摘　　要：综述了低温固化型光敏聚酰亚胺(PSPI)材料的研究与应用进展。从集成电路(IC)封装技术的发展对PSPI材料的性能需求、正性与负性PSPI材料的结构设计与制备化学技术以及上述PSPI材料实现低温固化的主要途径等角度进行了阐述。重点综述了外加交联剂型低温固化PSPI材料的研发现状以及潜在的工程化应用,并对低温固化型PSPI封装材料的未来发展趋势进行了展望。The current research and application status of low-temperature curable photosensitive polyimides(PSPIs)have been reviewed.The property requirements of integrated circuits(IC)packaging to the PSPI materials,the structural design and preparation chemistry of negative and positive PSPIs,and the main procedures for achieving the low-temperature curability of PSPIs were mainly introduced.Emphatically,the current research and development status,potential engineering applications,and future developing trends of the low-temperature curable PSPIs containing external crosslinkers were presented.

关 键 词：光敏聚酰亚胺 低温固化 交联剂 光敏性 热性能 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]