波峰焊引发的PCBA翘曲仿真分析及对策  

Simulation Analysis and Countermeasures of PCBA Warpage Caused by Wave Soldering

作　　者：胡涛 周信芳 郑俊彬 李亮 Hu Tao;Zhou Xinfang;Zheng Junbin;Li Liang(GAC Automobile Research&Development Center,Guangzhou 511434)

机构地区：[1]广州汽车集团股份有限公司汽车工程研究院,广州511434

出　　处：《汽车工艺与材料》2023年第12期20-25,共6页Automobile Technology & Material

摘　　要：针对试生产过程中的装配印制板(PCBA)翘曲而导致的安装困难问题进行初步分析,且通过特定的试验对比,找出了关键因素波峰焊。使用ABAQUS软件对波峰焊的过程进行热结构耦合有限元仿真分析,得出造成翘曲的原因有连接器基座材料耐温性差、基座材料与PCBA材料热膨胀系数相差大、工艺过程导致的受热不均等,同时出具了专业建议并制定了一系列验证方案,通过对各类方案的进一步验证和改进,最终成功地解决波峰焊导致的PCBA翘曲问题。This paper analyzed the problem of difficult installation of Printed Circuit Board Assembly(PCBA)caused by warping during trial production and identified wave soldering as the key factor through specific test comparison.ABAQUS was applied to perform thermal-structural coupling FEA simulation analysis of wave soldering process,it was concluded that poor temperature resistance of connector base material,large difference in thermal expansion coefficient between connector base material and PCBA material,uneven heating caused by process were the causes of PCBA warpage.Therefore,professional suggestions were provided and a series of verification schemes were developed for verification and improvement,which eventually eliminated PCBA warpage caused by wave soldering.

关 键 词：有限元分析 波峰焊 PCBA 翘曲 热结构耦合 

分 类 号：U466[机械工程—车辆工程]