改性聚偏氟乙烯树脂覆铜板的制备方法  

Preparation method of copper clad laminate with modified polyvinylidene fluoride resin

作　　者：刘俊秀 秦伟峰 李凌云 刘政 LIU Junxiu;QIN Weifeng;LI Lingyun;LIU Zheng(Shandong Jinbao Electronics Co.,Ltd.,Zhaoyuan 265400,Shandong,China)

机构地区：[1]山东金宝电子有限公司,山东招远265400

出　　处：《印制电路信息》2023年第12期17-19,共3页Printed Circuit Information

摘　　要：设计一种改性聚偏氟乙烯树脂组合物和覆铜板(CCL)的制备方法,在改性聚偏氟乙烯的制备中添加钛酸钡陶瓷粉,可增强黏合力和韧性;同时降低树脂组合物的固化温度,提高存储稳定性;在CCL中应用不仅有效改善了耐热性,同时也提高了电性能,具备较低的介电常数和介电损耗、较好的力学强度、高耐热、高Tg,且大大降低了成本。The preparation method of a modified polyvinylidene fluoride resin composition and a copper clad laminate is introduced.In this paper,barium titanate ceramic powder is added to the preparation of the modified polyvinylidene fluoride,which can enhance the adhesive force and enhance the toughness.At the same time,the curing temperature of the resin composition is reduced and the storage stability is improved,and the application in the copper clad laminate can not only effectively improve the heat resistance,but also improve the electrical properties.Its application leads to lower dielectric constant and dielectric loss,good mechanical strength,high heat resistance,and high glass transition temperature,and greatly reduce the cost.

关 键 词：覆铜板(CCL) 改性聚偏氟乙烯 高耐热 低D_(k)与D_(f) 

分 类 号：TN41[电子电信—微电子学与固体电子学]