高速基材钻孔晕圈改善研究  

Research on high speed material haloing after drilling

作　　者：唐海波 李逸林 刘梦茹 张志远 TANG Haibo;LI Yilin;LIU Mengru;ZHANG Zhiyuan(Shengyi Electronics Co.,Ltd.,Dongguan 523127,Guangdong,China)

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2023年第12期20-24,共5页Printed Circuit Information

基　　金：东莞市重点领域研发项目(20201200300022)。

摘　　要：高速材料为实现较低的Dk和Df,在树脂设计上会采用极性较低的基团,因此树脂与玻纤布间浸润性会大幅降低,经过钻孔和电镀后,会出现晕圈偏大的问题。通过对钻孔参数、钻刀及除胶等方面进行研究,发现化学除胶和钻孔参数是影响材料晕圈的主要因素,降低化学除胶强度可有效减少晕圈,但易带来铜内层连接不良(ICD)的问题。采用较高转速(0.25 mm钻刀采用130 kr/min左右)高进刀量钻孔参数时,可有效降低钻孔后晕圈,而采用排尘效果较好的涂层钻刀对晕圈的影响较小。High speed materials used very low polar groups in the polymer chain when designing the resin,so as to achieve low Dk and D,.However,the wettability between resin and glass fiber will be greatly reduced,and the haloing issue will be found after drilling and copper plating.Aiming at these problems,driling parameters,types of drill bits,and desmear parameters were researched.The results showed that,chemical desmear and drilling parameters were the key factors of haloing.Reducing the chemical desmear strength can lowering the haloing,but it also can lead to copper inner connection defect(ICD)problem.Using high rotation speed(0.25 mm drill bit with a 130 kr/min rotation speed)and high chip load for drilling can lead to a lower haloing after drilling and copper plating,and coating drill bits will have less influence on haloing.

关 键 词：高速材料 钻孔参数 除胶参数 钻孔晕圈 

分 类 号：TN41[电子电信—微电子学与固体电子学]