一种高耐热低羟基含磷环氧树脂的合成及性能研究  

Synthesis and Properties of a Novel Epoxy Containing Phosphorus with High Heat Resistance and Low Hydroxyl

作　　者：叶伦学[1] 唐文东[1] 邹静 曹静 YE Lunxue;TANG Wendong;ZOU Jing;CAO Jing(Sichuan EM Technology Co.,Ltd.,The State of Insulation Materials Engineering Technology Research Center,Mianyang 621000,China)

机构地区：[1]四川东材科技集团股份有限公司,国家绝缘材料工程技术研究中心,四川绵阳621000

出　　处：《化工技术与开发》2023年第12期24-26,31,共4页Technology & Development of Chemical Industry

摘　　要：本文以萘醌、DOPO、酚醛环氧树脂及异氰酸酯为原料,合成了一种高耐热低羟基含磷环氧树脂。将其与酚醛及苯并噁嗪树脂混胶后,浸在玻纤布中经压板固化后,通过示差扫描量热(DSC)测试了板材的玻璃化转变温度T_(g);采用平板电容法测试了树脂的介电性能,并测试了树脂的吸水率、阻燃性能、羟基当量等。结果表明,板材的玻璃化转变温度T_(g)高于170℃,板材具有较低的介电常数和介质损耗,D_(k)<3.50,D_(f)<0.01,吸水率<0.2%,阻燃达到V0级,作为覆铜板的基础树脂材料时,具有低介电、低介损、高T_g、低吸水、V0级阻燃等优良的综合性能。A novel phosphorus-containing epoxy with high heat resistance and low hydroxyl was synthesized from naphthoquinone,DOPO,phenolic epoxy and isocyanate.The glass transition temperature T_(g) and dielectric properties of the resin were measured by differential scanning calorimetry(DSC)and plate capacitance method,respectively.The results showed that the glass transition temperature T_(g) was higher than 170℃,the dielectric constant and dielectric loss were lower,D_(k)<3.50,D_(f)<0.01,water absorption<0.2%,and the flame retardant was V0.When it was used as copper clad laminate base resin material,it had low dielectric,low dielectric loss,high T_(g),low water absorption,V0 flame retardant and other excellent comprehensive properties.

关 键 词：低羟基含磷环氧树脂 低介电常数 低介质损耗 低吸水率 高耐热 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]