某雷达片式有源模块公差分析及优化  

Tolerance Analysis and Optimization of a Radar Chip Active Module

作　　者：杨婷婷 路伟欣 YANG Tingting;LU Weixin(The 38th Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《机械制造与自动化》2023年第6期69-71,76,共4页Machine Building & Automation

摘　　要：片式有源模块是雷达的核心部件,其集成度高但尺寸链公差设计难度大。针对片式有源模块在应力筛选实验后部分信号不通的问题,通过分析两条相互影响的轴向盲配互联尺寸链公差,确定弹性连接器和射频内转接器配合公差问题。针对该尺寸链的轴向盲配公差问题,结合实际情况,完成尺寸链公差优化设计。Chip active module,the core component of radar,is highly integrated but difficult to design dimension chain of tolerance.To solve the problem of partial signal impassability of chip active module after stress screening test,this paper analizes the dimensional chain tolerances of two axial blind matching interconnections and determines the fit tolerance problem of the elastic connector and the rf internal adapter.Aimed at the problem of axial blind fitting tolerance of the dimensional chain,the optimization design of dimensional chain tolerance is completed according to the actual situation.

关 键 词：尺寸链 片式模块结构 公差分析 公差优化设计 

分 类 号：TH123[机械工程—机械设计及理论]