多层多孔金属泡沫填充的水基散热器冷却CPU:基于热液和熵产分析角度  

CPU cooling with a water-based heatsink filled with multi-layered porous metal foam:Hydrothermal and entropy generation analysis

作　　者：Amin SHAHSAVAR Mohammad SHAHMOHAMMADI Majid SIAVASHI 

机构地区：[1]Department of Mechanical Engineering,Kermanshah University of Technology,Kermanshah 6715685420,Iran [2]Applied Multi-phase Fluid Dynamics Laboratory,School of Mechanical Engineering,Iran University of Science and Technology,Tehran 1684613114,Iran

出　　处：《Journal of Central South University》2023年第11期3641-3655,共15页中南大学学报（英文版）

摘　　要：本研究利用多层多孔金属泡沫从热液和熵产分析角度来改善散热器的性能,并采用计算流体力学方法进行数值模拟,将结果与单层金属泡沫和无金属泡沫情况进行了比较。对于多层泡沫,考虑了两种模式:层间渗透率随着CPU距离的增加而逐渐增加或减少。结果表明,当泡沫层渗透率随着CPU距离的增加而逐渐减少时,散热器的温度分布均匀性最好,热阻最低,对流系数最高,热液综合性能最好;当泡沫层渗透率随着CPU距离的增加而逐渐增加时,多层泡沫的摩擦熵最低,热熵最高,总熵产率最低。与不含金属泡沫的散热器相比,摩擦熵、热熵和总熵产率分别降低了64.51%~73.02%、42.80%~220.34%和19.68%~62.36%。In this research,the multi-layered porous foam is used to improve the performance of a heatsink from the hydrothermal and entropy generation perspectives.The research is done numerically using the computational fluid dynamics method.The results are compared with the case of single-layer metal foam and the case without metal foam.For the multi-layered foam,two modes are considered:the permeability of layers gradually increases or decreases by moving away from the CPU.The analysis showed that if the permeability of foam layers gradually decreases by moving away from the CPU,the heatsink has the best uniformity of temperature distribution,the lowest thermal resistance,the highest convection coefficient,and in general,the best overall hydrothermal performance.Also,it was seen that the multi-layered foam whose layer permeability increases by moving away from the CPU has the lowest frictional entropy,the highest thermal entropy,and the lowest total entropy generation rate.The frictional,thermal,and total entropy generation rates were respectively 64.51%−73.02%lower,42.80%−220.34%higher,and 19.68%−62.36%lower than that of the heatsink without metal foam.

关 键 词：散热片 熵产分析 CPU冷却 传热 多层多孔泡沫 热阻 

分 类 号：TP332[自动化与计算机技术—计算机系统结构] TK124[自动化与计算机技术—计算机科学与技术]