FeCrNi中熵合金薄膜电沉积工艺正交优化及其耐蚀性  

Orthogonal optimization of electrodeposition conditions for preparation of medium-entropy FeCrNi alloy film and its corrosion resistance

作　　者：孙振 黄峰[1] 袁玮[1] 黄桢婧 刘静[1] SUN Zhen;HUANG Feng;YUAN Wei;HUANG Zhenjing;LIU Jing(The State Key Laboratory of Refractories and Metallurgy,Wuhan University of Science and Technology,Wuhan 430081,China)

机构地区：[1]武汉科技大学、省部共建耐火材料与冶金国家重点实验室,湖北武汉430081

出　　处：《电镀与涂饰》2023年第23期32-39,共8页Electroplating & Finishing

基　　金：国家自然科学基金(U21A20113)。

摘　　要：采用电化学沉积法在铜基体上制备FeCrNi中熵合金薄膜,以沉积速率和电流效率为评价指标,通过四因素三水平正交试验得到电沉积的较优工艺条件为:电流密度200 mA/c^(2)或100 mA/c^(2),温度30℃,时间15 min。采用X射线衍射仪(XRD)、场发射电子探针显微镜(EF-EPMA)分析了较优条件下所得FeCrNi中熵合金薄膜的显微组织和元素分布,并采用电化学方法研究了其在3.5%NaCl溶液中的耐蚀性。结果表明,所得FeCrNi中熵合金薄膜由大量球状颗粒组成,为非晶态结构,表面存在大量微裂纹,Fe、Cr、Ni三种元素在薄膜中分布均匀。综合考虑电沉积速率、电流效率及FeCrNi中熵合金薄膜的耐蚀性后确定电沉积的最佳电流密度为100 mA/c^(2)。Medium-entropy FeCrNi alloy films was prepared by electrodeposition.A four-factor and three-level orthogonal test was conducted to optimize the electrodeposition conditions by evaluating the deposition rate and current efficiency.The optimal conditions were determined preliminarily as follows:current density 200 or 100 mA/c^(2),temperature 30℃,and time 15 min.The microstructure and element distribution of medium-entropy FeCrNi alloy film were analyzed using X-ray diffractometer(XRD)and field-emission electron probe micro-analyzer(EF-EPMA).The corrosion resistance of medium-entropy FeCrNi alloy film was studied in 3.5%NaCl solution by electrochemical method.The results showed that the FeCrNi medium-entropy alloy film was amorphous and composed of plenty of spherical particles with many micro-cracks.Fe,Cr,and Ni were uniformly distributed throughout the film.In comprehensive consideration of the deposition rate,current efficiency,and corrosion resistance of medium-entropy FeCrNi alloy film,100 mA/c^(2)was determined to be the best current density for electrodeposition.

关 键 词：电沉积 铁铬镍中熵合金薄膜 正交试验 显微组织 耐腐蚀性能 

分 类 号：TQ153.2[化学工程—电化学工业]