LTCC基板金锡焊接的返修过程质量控制  

Quality control during the repairing of LTCC substrate after gold-tin soldering

作　　者：杨钊[1] 任小良 陈娜 唐旭[1] 朱佳明 YANG Zhao;REN Xiaoliang;CHEN Na;TANG Xu;ZHU Jiaming(Xi’an Institute of Space Radio Technology,Xi’an 710100,China)

机构地区：[1]西安空间无线电技术研究所,陕西西安710100

出　　处：《电镀与涂饰》2023年第23期56-63,共8页Electroplating & Finishing

摘　　要：低温共烧陶瓷(LTCC)基板与硅铝壳体的一体化烧结在航天T/R组件领域具有成熟而广泛的应用,但在实际生产中不可避免地存在因组件性能不达标而需要返修LTCC基板的情况。本文对LTCC基板的金锡返修焊接进行失效分析,指出在多个基板紧密贴合的组件中,各LTCC基板的间距应大于0.1 mm;对于需返修焊接的硅铝壳体,推荐采用化学镍+电镀镍的工艺制备镍层,并且电镀镍层的厚度应大于2μm。The integrated sintering of low-temperature co-fired ceramic(LTCC)substrate and silicon-aluminum shell has mature and extensive applications in aerospace T/R module industry.However,it is inevitable to face the reparation of some LTCC substrates due to unqualified properties of the module in practical production.The failure reasons of LTCC substrate were analyzed in this paper.It was advised that the interspace between different LTCC substrates should be 0.1 mm above for the modules with multiple closely-arrayed substrates.It is better to prepare the nickel coating by electroless nickel plating prior to nickel electroplating for silicon-aluminum shells to be repaired,and the thickness of electroplated nickel coating should be more than 2μm.

关 键 词：低温共烧陶瓷基板 硅铝壳体 金锡焊接 返修 镍 

分 类 号：TQ153.2[化学工程—电化学工业]