TiZrNiCu钎料在TA1/TC4异质界面的反应润湿过程  

Study on the reactive wetting process of TiZrNiCu on TA1/TC4 heterogeneous interface

作　　者：高德君[1] 武绍旺 杨生旭 张承浩[1] 刘永旭 司晓庆 曹健[1] Gao Dejun;Wu Shaowang;Yang Shengxu;Zhang Chenghao;Liu Yongxu;Si Xiaoqing;Cao Jian(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China;Xi’an Space Engine Company Limited,Xi’an 710100,China)

机构地区：[1]哈尔滨工业大学,先进焊接与连接国家重点实验室,哈尔滨150001 [2]西安航天发动机有限公司,西安710100

出　　处：《机械制造文摘（焊接分册）》2023年第5期12-18,共7页Welding Digest of Machinery Manufacturing

基　　金：国家自然科学基金杰出青年项目(52125502);国家自然科学基金青年项目(52005131);黑龙江省“头雁”团队经费资助项目(HITTY-20190013)。

摘　　要：试验采用Ti51ZrNiCu钎料,研究其在TA1/TC4异质界面的反应润湿过程,使用扫描电子显微镜(SEM)、能谱分析仪(EDS)及润湿角测量仪等分析方法研究了不同表面的润湿界面组织结构,并总结了试验参数对组织结构和润湿能力的影响规律。而后进行了填缝试验,用于衡量Ti51ZrNiCu钎料在TA1/TC4异质界面的润湿铺展能力,总结了钎料填充经验公式。结果表明,在试验参数为935℃/3 min的条件下,TiZrNiCu钎料对TA1和TC4母材填充能力可简化为经验公式:h=4000/a,其中钎缝间隙a的单位为μm,爬升高度h单位为mm。Ti51ZrNiCu filler alloy was used to study the reactive wetting process on TA1/TC4 heterogeneous interface.The interfacial microstructure of different surfaces was studied by scanning electron microscope(SEM),energy dispersive spectrometer(EDS)and wetting angle measuring instrument.And the influences of experiment parameters on interfacial microstructure and wettability were summarized.The filling experiment was finished to evaluate the wetting and spreading ability of TiZrNiCu on TA1/TC4 heterogeneous interface.The empirical equation of filling experiment was summarized.The empirical equation,h=4000/a,was used to assess filling ability of TiZrNiCu on TA1/TC4 heterogeneous interface at 935℃for 3 min.In this empirical equation,the unit of brazing gap a isμm,and the unit of climbing height h is mm.

关 键 词：TC4合金 TA1合金 TiZrNiCu钎料 润湿 填缝试验 

分 类 号：TG454[金属学及工艺—焊接]