图案化聚合物刷辅助金属无电沉积制备铜图案及应用  

Fabrication of Cu Patterns via Patterned PMETAC Brushes Assisted Electroless Deposition and Its Application

作　　者：魏中华 高浩 付少戈 陈涛 赵海利 ZhonghuaWei;Hao Gao;Shaoge Fu;Tao Chen;Haili Zhao(Faculty of Chemical Engineering,Kunming University of Science and Technology,Kunming 650504,China)

机构地区：[1]昆明理工大学化学工程学院,云南昆明650504

出　　处：《高分子材料科学与工程》2023年第9期150-157,共8页Polymer Materials Science & Engineering

基　　金：国家自然科学基金资助项目(52103262);云南省基础研究专项青年项目(202201AU070103)。

摘　　要：提出了聚合物刷辅助金属选择性沉积制备铜图案的方法。利用聚多巴胺(PDA)将光引发表面原子转移自由基聚合(ATRP)引发剂接枝到硅基体表面,以甲基丙烯酰氧乙基三甲基氯化铵(METAC)为反应单体,通过数字微镜器件(DMD)调控光辐照选择性引发ATRP反应制备了离子型PMETAC聚合物刷图案,采用X射线光电子能谱仪(XPS)、光学显微镜和原子力显微镜(AFM)对所制备图案的化学组成、几何形状及表面形貌进行了表征分析,结果表明图案化PMETAC刷的成功制备。以PMETAC刷图案化表面为模板,通过PMETAC刷末端带正电的季铵盐基团与活性离子[PdCl4]2-进行离子交换将金属催化剂固定在聚合物刷分子链上以诱导铜沉积,光学显微镜和XPS的分析结果表明了铜在PMETAC聚合物刷区域的选择性沉积。对不同尺寸铜图案表面的电性能进行研究,设计了通过硅片表面铜图案连接导线以点亮发光二极管的实验,结果表明该方法制备的铜图案具有优异的导电性。相关研究工作为图案化聚合物刷辅助金属沉积技术在复杂电路制备领域的应用提供了借鉴。A versatile method,based on the patterned surface assisted metal selective deposition,was developed for fabricating Cu patterns in this study.The polydopamine(PDA)adhesive layer was applied for the covalent immobilization of atom transfer radical polymerization(ATRP)initiator on silicon substrate.With 2-(methacryloyloxy)ethyl trimethylammonium chloride(METAC)as monomer,the patterned poly(2-(methacryloyloxy)ethyl trimethylammonium chloride)(PMETAC)brushes were generated by employing digital mirror device(DMD)-based light modulation technique to regulate the ATRP process.The chemical composition,geometric structure and surface morphology of the resulting patterns were characterized by X-ray photoelectron spectroscopy,optical microscopy and atomic force microscopy,the results indicate the successful fabrication of patterned PMETAC brushes.With the patterned PMETAC brushes as template,the immobilization of metal catalyst was achieved through the ionic exchange between the positively charged quaternary ammonium groups at the side chains of PMETAC brushes and metal anions[PdCl4]2−,leading to the selective deposition of copper.The electrical properties of Cu patterns with different sizes were studied and an experiment in which the wires are connected through a copper pattern on the surface of silicon wafer to light up a light-emitting diode was designed.The results demonstrate that the copper pattern obtained by this method shows excellent electrical conductivity.The research provides fundamental technical support for expanding the application of patterned polymer brushes assisted metal deposition technology in complex circuit preparation.

关 键 词：聚多巴胺 图案化PMETAC刷 无电沉积 铜图案 

分 类 号：TN05[电子电信—物理电子学]