元器件性能退化机理及寿命预测方法研究  

Study on the Degradation Mechanisms and Life Prediction Methods of Components

作　　者：李凌 林瑞仕[2] 朱旭锋[2] 王欢 薛宁[2] LI Ling;LIN Ruishi;ZHU Xufeng;WANG Huan;XUE Ning(Xi’an Microelectronics Technology Institute,Xi’an 710068,China;Beijing Aerospace Automatic Control Institute,Beijing 100854,China)

机构地区：[1]西安微电子技术研究所,陕西西安710068 [2]北京航天自动控制研究所,北京100854

出　　处：《电子质量》2023年第11期98-104,共7页Electronics Quality

摘　　要：随着装备可靠性的不断提高,电气系统元器件面临长时间加电连续工作的需求,需要对其性能退化机理和寿命进行研究。元器件长时间加电失效机理与其内部结构、材料、制造工艺和使用环境等密切相关。首先,从物理、化学微观分子层面研究了长时间工作状态下其芯片及封装结构退化机理,并结合失效案例分析元器件材料、结构和工艺特点,研究了芯片及封装结构的性能退化表征和性能退化模型;然后,根据电性能及封装结构性能参数数据构建寿命预测模型,建立了基于失效物理的元器件长时间加电退化机理及寿命预测方法;最后,给出实际案例验证了方法的可行性,解决了元器件退化轨迹及故障预测难题。With the continuous improvement of equipment reliability,electrical system components face continuous operation requirements,so it is necessary to study their performance degradation mechanisms and life.The failure mechanisms of the components with continuous power-on operation are related to their structure,material,process,and using.Firstly,the degradation mechanisms of chip and package under continuous operation conditions are studied from the physical and chemical microscopic levels,the material,structure,and process characteristics of components are analyzed with failure cases,and the performance degradation characterization and performance degradation model of chip and package structure are studied.Then,the life prediction model is constructed based on the electrical properties and package structure performance parameters,and the degradation mechanisms and life prediction methods for components with long-time continuous power-on operation are established based on failure physics.Finally,practical cases are given to verify the feasibility of the method which solves the problems of component degradation trajectory and failure prediction.

关 键 词：元器件 退化机理 连续加电 

分 类 号：TB114.3[理学—概率论与数理统计]