基于PTFE材料的印制电路板背钻塞孔加工工艺研究  

Research on the Processing Technology of Drilling Plug Holes on the Back of Printed Circuit Board Based on PTFE Material

作　　者：李东轩 李永东 何瑞 宁会峰[3] 邓家庆 Li Dong-xuan;Li Yong-dong;He Rui;Ning Hui-feng;Deng Jia-qing(Tianshui Minshan Machinery Co.,Ltd.,Gansu Tianshui 741000;China Railway Chang’an Heavy Industry Co.,Ltd.,Xi’an,Shaanxi,710000;Lanzhou University of Technology,Lanzhou Gansu 730050,China)

机构地区：[1]天水岷山机械有限责任公司,甘肃天水741000 [2]中铁长安重工有限公司,陕西西安710000 [3]兰州理工大学机电工程学院,甘肃兰州730050

出　　处：《凿岩机械气动工具》2023年第4期37-45,共9页Rock Drilling Machinery & Pneumatic Tools

摘　　要：当前PTFE材料PCB背钻树脂塞孔性不良率较高,缺乏加工方案与工艺参数标准。本文基于塞孔机理及其力学模型分析结果,开展PTFE材料性能试验,实验表明PTFE板材在高温熔融压合过程中压合后板内的微孔结构对此类材料背钻塞孔不良有重要影响。基于此类材料开展加工实验,得出塞孔前烘板和时效管理以及塞孔抽真空的加工方法能有效解决PTFE板材自身难浸润性和涨缩不稳定导致板内微孔隙的水汽问题,从而减少塞孔凹陷,使PTFE材料PCB背钻塞孔FTY提升3倍。At present,the defect rate of back drilling resin plug holes on PTFE material based PCB is high,and there is a lack of processing plans and process parameter standards.Based on the mechanism of plug holes and the analysis results of its mechanical model,this article conducted performance tests on PTFE materials.The tests showed that the microporous structure in PTFE sheets after high temperature melting and pressing is an important adverse factor affecting the poor back drilling plug holes of such materials.Based on this type of material,processing experiments have been conducted,and the processing methods of drying the board before the plug hole,aging management,and vacuuming of the plug hole can effectively solve the problem of water vapor in the micro pores inside the PTFE board due to its hard wettability and unstable expansion and contraction,thereby reducing the plug hole depression and increasing the FTY of the plug hole drilled on the back of the PTFE material PCB by three times.This research work provides important reference significance for the back drilling plug hole process of PTFE printed PCB.

关 键 词：PTFE材料 印制电路 塞孔 加工工艺 

分 类 号：TN41[电子电信—微电子学与固体电子学]