钎焊温度对Cu-Sn-Ti-Ga钎料钎焊金刚石接头组织及性能的影响  

Effect of Brazing Temperature on Microstructure and Mechanical Properties of Brazed Diamond with Cu-Sn-Ti-Ga Solder

作　　者：王楠 张雷 纠永涛 冯帅帅 程战 秦建 陈继 李家茂[1] 徐东 WANG Nan;ZHANG Lei;JIU Yongtao;FENG Shuaishuai;CHENG Zhan;QIN Jian;CHEN Ji;LI Jiamao;XU Dong(School of Materials Science and Engineering,Anhui University of Technology,Ma'anshan 243002,China;School of Materials Science and Engineering,Anhui Polytechnic University,Wuhu 241000,China;China Innova-tion Academy of Intelligent Equipment Co.,Ltd.,Ningbo 315700,China;State Key Laboratory of Advanced Braz-ing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering Co.,Ltd.,Zhengzhou 450001)

机构地区：[1]安徽工业大学材料科学与工程学院,安徽马鞍山243002 [2]安徽工程大学材料科学与工程学院,安徽芜湖241000 [3]中机智能装备研究院(宁波)有限公司,浙江宁波315700 [4]郑州机械研究所有限公司/新型钎焊材料与技术国家重点实验室,河南郑州450001

出　　处：《材料研究与应用》2023年第6期1125-1133,共9页Materials Research and Application

基　　金：国家自然科学基金项目(52271017);安徽省重点研究与开发计划项目(2022i01020008);宁波市自然基金项目(2021J042)。

摘　　要：探讨了Cu-Sn-Ti-Ga复合钎料在900—980℃钎焊温度下对金刚石/钢进行钎焊连接,研究了钎焊温度对钎焊金刚石微观形貌、界面特征、元素分布变化及力学性能的影响。结果表明,Cu-Sn-Ti-Ga复合钎料在金刚石表面润湿性良好,钎焊界面主要包含Cu_(5.6)Sn、TiC及富Ga相;随着钎焊温度的提高,金刚石的出露度逐渐降低,石墨化程度逐渐增大,导致钎焊接头的磨削性能呈现先增大后减小的趋势;当钎焊温度为920℃时,界面处已形成连续均匀的TiC反应层,反应层厚度为0.31μm、硬度达到最大值为310 HV0.1;金刚石试样的磨损形式表现为均匀磨损,钎料对金刚石的把持力较高。本研究为低成本钎料的发展和应用提供了理论基础。In this work,a Cu-Sn-Ti-Ga composite filler was employed for brazing diamond to steel within the temperature range of 900—980℃.The impact of brazing temperature on the microstructure,interface characteristics,element distribution,and mechanical properties of the brazed diamond were systematically investigated.The results showed that the filler exhibited excellent wettability on the diamond surface,with the brazing interface layer predominantly composed of Cu_(5.6)Sn,TiC and a Ga rich phase.With the increase of brazing temperature,the exposure of diamond gradually decreased,the graphitization degree of diamond increased,and the grinding performance of the brazed joints exhibited an initial increase followed by a subsequent decrease.Notably,at a brazing temperature of 920℃,a continuous and uniform TiC reaction layer with a thickness of 0.31μm formed at the interface.Microhardness tests showed that the diamond hardness reached a maximum value of 310 HV0.1,exhibiting uniform wear,and the solder demonstrated a robust holding force on the diamond.This investigation provides valuable insights for the development and application of low-cost brazing materials,offering a theoretical foundation for future advancements in this field.

关 键 词：复合钎料 钎焊温度 金刚石 铜基钎料 磨削性能 

分 类 号：TG401[金属学及工艺—焊接]