MEMS气体传感器微热板芯片热均匀性设计及性能  

Thermal Uniformity Design and Performance of MEMS Gas Sensor Micro-Hotplate Chip

作　　者：田昕[1] 陶继方 庞子瑞 林玉哲 赵佳[1,2] 袁泓晔 郑春宏 贺帅斌 于泽平 Tian Xin;Tao Jifang;Pang Zirui;Lin Yuzhe;Zhao Jia;Yuan Hongye;Zheng Chunhong;He Shuaibin;Yu Zeping(Key Laboratory of Laser and Infrared System of Ministry of Education,Shandong University,Qingdao 266237,China;School of Information Science and Engineering,Shandong University,Qingdao 266237,China;State Key Laboratory for Mechanical Behavior of Materials,School of Materials Science and Engineering,Xi'an Jiaotong University,Xi'an 710000,China;Natural Gas Sales Shandong Branch,PetroChina Company Limited,Jinan 250000,China)

机构地区：[1]山东大学激光与红外系统集成技术教育部重点实验室,山东青岛266237 [2]山东大学信息科学与工程学院,山东青岛266237 [3]西安交通大学材料科学与工程学院金属材料强度国家重点实验室,西安710000 [4]中国石油天然气股份有限公司天然气销售山东分公司,济南250000

出　　处：《微纳电子技术》2023年第11期1834-1841,共8页Micronanoelectronic Technology

摘　　要：基于微电子机械系统(MEMS)技术的气体传感器具有灵敏度高、尺寸小、响应速度快、功耗低等优点,成为下一代半导体气体传感器的重要发展方向,其中敏感氧化物材料的温度均匀性对其探测灵敏度、选择性和可靠性均有重要影响。聚焦MEMS气体传感器中的核心微热板芯片的设计,通过热学分析和物理场有限元仿真,设计了一种等温热区占比90%的微热板芯片,有效解决了MEMS气体传感器中微小芯片内大面积均匀加热问题。在此理论基础上,设计了两款微热板芯片结构并进行了表征。实际测试结果显示温度-功耗曲线与仿真结果一致,在372℃工作温度下,方形薄膜结构的微热板芯片单位面积功耗仅为2.8×10^(-4)mW/μm^(2),但圆形薄膜结构的微热板芯片温度分布更均匀,两种设计的工作温度均可以达到370℃以上。受限于低温成膜工艺,该微热板芯片薄膜的最大应力仅为1500 MPa左右,这为后续优化设计提升工作温度和降低功耗提供了一定参考。Gas sensors based on micro-electromechanical system(MEMS)technology have the advantages of high sensitivity,small size,fast response speed and low power consumption,and become an important development direction of the next generation semiconductor gas sensors.The temperature uniformity of sensitive oxide materials has an important effect on its detection sensitivity,selectivity and reliability.By focusing on the design of the core micro-hotplate chip for MEMS gas sensor,a micro-hotplate chip with isothermal hot zone accounting for 90%was designed through thermal analysis and physical finite element simulation,effectively solving the problem of large area uniform heating within the micro-chip in MEMS gas sensors.Based on the theory,two kinds of micro-hotplate chip structures were designed and characterized.The actual test results show that the temperature-power consumption curves are consistent with the simulation results.At 372℃working temperature,the power consumption per unit area of the micro-hotplate chip with a square thin film structure is only 2.8×10^(-4)mW/μm^(2),while the temperature distribution of the micro-hotplate chip with a circular thin film structure is more uniform,and the working temperature of the two designs is higher than 370℃.Limited by low temperature thin film forming process,the maximum stress of the micro-hotplate chip thin film is only about 1500 MPa.This provides a certain reference for the subsequent optimization design to increase working temperature and reduce power consumption.

关 键 词：微电子机械系统(MEMS) 气体传感器 微热板芯片 有限元仿真 低功耗 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置] TH703[自动化与计算机技术—控制科学与工程]