低介电聚合物复合材料发展现状  

Current Status Progress of Low Dielectric Polymer Composite

作　　者：吉喆[1] 贠浩辰 张康宁 段远多 吕生华[1] 刘雷鹏 JI Zhe;YUN Haochen;ZHANG Kangning;DUAN Yuanduo;LYU Shenghua;LIU Leipeng(Shaanxi University of Science&Technology,Xi’an,Shaanxi 710021,China)

机构地区：[1]陕西科技大学,陕西西安710021

出　　处：《塑料》2023年第6期105-110,115,共7页Plastics

摘　　要：随着航空、交通以及5G通信领域的快速发展,对聚合物材料的介电性能提出了更高的要求。在大型工业以及科研中,急需开发具有更低介电性能的聚合物材料。聚酰亚胺(PI)、环氧树脂(EP)、氰酸酯树脂(CE)、聚丁二烯树脂(PB)等低介电聚合物在电子通信领域具有较大的发展潜力。综述了PI、EP、CE及PB基复合材料在降低介电常数以及介电损耗等方面的研究进展。降低聚合物介电常数和介电损耗,可以通过生成的空芯或孔隙结构引入空气或者通过降低摩尔极化率,达到改善低介电复合材料介电性能的目的。深入研究了复合材料的介电性能与频率、温度及填料含量的关系,并且提出了关于低介电聚合物基复合材料应用前景和未来发展方向的展望。With the rapid development of aviation,transportation and 5G communication,higher requirements are put forward for dielectric properties of polymer materials.In large scale industry and scientific research,it is urgent to develop polymer materials with lower dielectric propertis.Polyimide(PI),epoxy resin(EP),cyanate resin(CE),polybutadiene resin(PB)and other low dielectric polymers have great development potential in the field of electronic communication.This paper reviews the research progress of PI,EP,CE and PB based composite in reducing dielectric constant and dielectric loss.Reduce the dielectric constant and dielectric loss of polymer,on the one hand,air is introduced through the generated hollow core or pore structure,and on the other hand,the dielectric properties of low dielectric composite are improved by reducing the molar polarization.The relationship of dielectric properties of composite with frequency,temperature and filler content was studied in depth,and the potential application prospect and future development direction of low dielectric polymer matrix composite were put forward.

关 键 词：低介电常数 复合材料 聚酰亚胺 环氧树脂 氰酸酯树脂 聚丁二烯树脂 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]