基于Al_(2)O_(3)陶瓷的Pt/PtRh型厚膜热电偶封装测试  

Packaging and testing of Pt/PtRh type thick-film thermocouple based on Al_(2)O_(3) ceramic

作　　者：赵楠 刘涛 谢浩 董和磊 谭秋林[1,2,3] ZHAO Nan;LIU Tao;XIE Hao;DONG Helei;TAN Qiuin(Key Laboratory of Electronic Testing Technology,North University of China,Taiyuan 030051,China;Key Laboratory of Instrumental Science and Dynamic Testing,Ministry of Education,North University of China,Taiyuan 030051,China;Micron Nano Research Center,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学电子测试技术重点实验室,山西太原030051 [2]中北大学仪器科学与动态测试教育部重点实验室,山西太原030051 [3]中北大学微米纳米技术研究中心,山西太原030051

出　　处：《传感器与微系统》2024年第1期128-130,134,共4页Transducer and Microsystem Technologies

基　　金：国家重点研发计划资助项目(2018YFB2003103);国家自然科学基金资助项目(U1837209,51875534)。

摘　　要：设计了一种基于氧化铝(Al_(2)O_(3))柱体的Pt/PtRh型厚膜热电偶。采用丝网印刷工艺完成传感器功能层的制备,这种方法工艺简单、可操作性强、成本低廉。对所制备的厚膜热电偶进行封装设计并进行测试。实验结果表明:带封装热电偶的迟滞大小为4.10%,小于无封装的7.65%,而且带封装热电偶在高温阶段与标准热电偶极其吻合,其平均塞贝克系数更接近于标准热电偶。实验结果均表明封装设计有利于膜状热电偶测试的准确性,达到了工程化需要。A Pt/PtRh type thick film thermocouple based on Al_(2)O_(3) cylinder is designed.Functional layer of sensor is prepared by screen printing process,which is simple in process,strong in operability and low in cost.Packaging design and test of the prepared thick-film thermocouple is carried out.The experimental results show that the hysteresis of the packaged thermocouple is 4.10%,which is less than 7.65% of the unpackaged thermocouple,and the packaged thermocouple is very consistent with the standard thermocouple at high temperature,and its average Seebeck coefficient is closer to the standard thermocouple.The experimental results all show that the design of packaging is beneficial to the accuracy of the film thermocouple test and meets the needs of engineering.

关 键 词：Pt/PtRh型热电偶 厚膜 丝网印刷 封装 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置] TB34[自动化与计算机技术—控制科学与工程] TN304[一般工业技术—材料科学与工程]