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作 者:赵晓君 罗旭良 翁梦蔓 闵永刚 ZHAO Xiaojun;LUO Xuliang;WENG Mengman;MIN Yonggang(School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China)
机构地区:[1]广东工业大学材料与能源学院,广州510006
出 处:《功能材料》2023年第12期12018-12022,共5页Journal of Functional Materials
基 金:国家自然科学基金(U20A20340);国家重点研发计划(2020YFB0408100)。
摘 要:为确保电子设备的正常运行和安全工作,围绕电子元器件热管理的研究近年来热度持续升高,聚酰亚胺(PI)作为基材生产的石墨膜是一种重要的导热材料,且能通过掺杂改性提高石墨膜的导热性能。而相较于固体导热填料,离子液体与聚酰亚胺基体的相容性更好,已常见于气体分离膜、无色聚酰亚胺(CPI)等应用。以4,4′-二氨基苯酰替苯胺(DABA)与3,3′,4,4′-联苯四甲酸二酐(BPDA)作为单体,利用1-乙基-3-甲基咪唑双三氟甲磺酰亚胺盐(IL)这一具有多个氢键位点的IL对PI薄膜进行改性,而后通过石墨化制备得高导热石墨膜。研究结果表明,IL含量为5.0%(质量分数)时,石墨膜晶粒尺寸为78.417 nm,石墨化程度达88%,导热系数达770 W/m·K,为纯PI基石墨膜的1.53倍。In order to ensure the normal operation and safety at work of electronic equipment,the research on thermal management of electronic components has continued increasing in recent years.Graphite film produced with polyimide(PI)as the substrate is an important thermal conductivity material,and its thermal conductivity can be improved through doping modification.Compared with solid thermal conductive filler,ionic liquid has better compatibility with polyimide matrix,and has been commonly used in gas separation membrane,colorless polyimide(CPI)and other applications.This article used 4,4′-diaminobenzoylanilide(DABA)and 3,3′,4,4′-biphenyltetracarboxylic dianhydride(BPDA)as monomers,and modified PI films by using 1-ethyl-3-methylimidazolium bis[(trifluoromethyl)sulfonyl]imide(IL)that had the characteristic of multiple hydrogen bond sites.Then,high thermal conductivity graphite film was prepared by graphitization.The research results show that when the IL content is 5.0 wt%,the grain size of the graphite film is 78.417 nm,the degree of graphitization reaches 88%,and the thermal conductivity reaches 770 W/mK,which is 1.53 times that of the pure PI cornerstone ink film.
分 类 号:TB34[一般工业技术—材料科学与工程]
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