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作 者:罗浩奇 万思杰 王剑勇 江叶 明汉锋 肖鑫宇 周魏华[1] LUO Haoqi;WAN Sijie;WANG Jianyong;JIANG Ye;MING Hanfeng;XIAO Xinyu;ZHOU Weihua(School of Physics and Materials Science,Nanchang University,Nanchang 330031,China)
机构地区:[1]南昌大学物理与材料学院,江西南昌330031
出 处:《南昌大学学报(工科版)》2023年第4期307-315,共9页Journal of Nanchang University(Engineering & Technology)
基 金:国家自然科学基金项目(52163005);江西省自然科学基金项目(20202BA204011);2021年度江西省高层次高技能领军人才项目。
摘 要:针对导热复合材料中填料含量过多会导致力学等性能下降以及三维导热骨架中黏合剂与树脂基体相容性差的问题,本文采用牺牲盐模板法,制备了基于聚苯并噁嗪/氮化硼(PPH-ddm/BN)三维导热骨架,进一步与环氧树脂(epoxy,EP)复合,得到了环氧树脂/聚苯并噁嗪/氮化硼(EP/PPH-ddm/BN)复合材料。当BN质量分数为19%时,复合材料的导热系数为1.01 W·m^(-1)·K^(-1),比纯环氧树脂提高了381%。归因于三维导热网络的形成以及聚苯并噁嗪和环氧树脂间良好的相容性,降低了氮化硼与树脂基体的界面热阻。骨架碳化后,环氧树脂/碳/氮化硼(EP/C/BN)复合材料的导热系数最高可达1.38 W·m^(-1)·K^(-1),比纯环氧树脂提高了557%,为目前相同BN含量下聚合物基复合材料的最高值。复合材料的硬度与弯曲强度随BN含量增加而提高,相关研究为发展填料含量较低的热管理材料提供了新思路。High content of thermally conductive fillers may eventually lead to the serious depression of mechanical properties in polymer composites.Additionally,the miscibility between adhesive in the three-dimensionally(3D)thermally conductive skeleton and polymer matrix often remains to be poor.In order to solve the above problems,the interconnected 3D thermally conductive polybenzoxazine/hexagonal boron nitride(PPH-ddm/BN)skeleton was fabricated using the sacrificing salt template method,in which BN act as fillers and polybenzoxazine(PPH-ddm)work as adhesives,respectively.After pouring of the epoxy(EP)resin,the EP/PPH-ddm/BN composites could be fabricated after curing.The EP/PPH-ddm/BN composite exhibited a thermal conductivity of 1.01 W·m^(-1)·K^(-1) as BN mass fraction is 19%,which was about 381%higher than the neat epoxy resin.The thermal conductivity was among the highest value at low content of BN fillers reported previously.The obvious increase of thermal conductivity in composites was associating with the formation of 3D fillers network and good compatibility between PPH-ddm and epoxy resin,reducing the thermal resistance at binding interfaces of BN sheets in 3D skeleton.After carbonization of PPH-ddm/BN skeleton,the corresponding EP/C/BN composite exhibited the thermal conductivity value of 1.38 W·m^(-1)·K^(-1),which was 557%higher than the neat epoxy resin.The research could provide new guidelines to develop composites in the field of thermal management composites at low filler content.
关 键 词:氮化硼 导热复合材料 环氧树脂 苯并噁嗪 相容性
分 类 号:TQ323.5[化学工程—合成树脂塑料工业]
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