贴片电阻阻值变化分析  

Analysis of patch resistance value

作　　者：王谌凯 庞聪 孙妍嫣 夏兵 WANG Chenkai;PANG Cong;SUN Yanyan;XIA Bing(Panasonic Appliances(China)Co.,Ltd.Hangzhou 310018)

机构地区：[1]松下家电(中国)有限公司,浙江杭州310018

出　　处：《家电科技》2023年第S01期341-342,共2页Journal of Appliance Science & Technology

摘　　要：伴随贴片电阻在家电产品PCB板上大量应用,因贴片电阻发生的产品不良率也随之上升。在金属膜插脚电阻年代,电阻不良主要表现为烧糊、生锈、阻值变大,而贴片电阻不良现象之一反而是电阻值变小。通过设计PCB板环境可靠性试验,诱发PCB板不良,通过电性能分析进而锁定贴片电阻,然后通过电阻的构造观测,分析得出原因是贴片电阻在通电温湿度环境下内部发生银元素迁移,从而导致电阻值下降。With the large application of patch resistance on the PCB board of home appliances,the adverse occurrence of patch resistance also increase.In the age of metal film pin resistance,the poor resistance is mainly manifested as burning,rust,larger resistance value,and one of the bad resistance phenomena of the patch is the smaller resistance value.Through the environmental reliability test of PCB board,induce the PCB failure,lock the patch resistance through electrical performance analysis,and then observe the resistance structure,analyze the patch resistance internal silver element migration in the electric temperature and humidity environment,resulting in the decrease of resistance value.

关 键 词：阻值变化 构造分析 元素迁移 

分 类 号：TM54[电气工程—电器]