热解碳泡沫材料吸波机理研究  

Research on the Microwave Absorption Mechanism of Pyrolytic Carbon Foam Materials

作　　者：林立海 李处森[1] 颜雨坤[1] 白炜琛 刘利冉 张劲松[1] LIN Lihai;LI Chusen;YAN Yukun;BAI Weichen;LIU Liran;ZHANG Jinsong(Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China;School of Materials Science and Engineering,University of Science and Technology of China,Hefei 230026,China)

机构地区：[1]中国科学院金属研究所,沈阳110016 [2]中国科学技术大学材料科学与工程学院,合肥230026

出　　处：《材料导报》2024年第1期17-23,共7页Materials Reports

摘　　要：为避开高分子材料作为基体,进一步拓展碳系吸波材料在空间环境或仿空间环境中的应用,本工作提出了预制体法结合热解工艺制备热解碳泡沫吸波材料的新思路,采取从400℃到1 500℃的不同目标热解温度制备了一系列热解碳泡沫材料,通过对不同温度热解碳泡沫材料的傅里叶红外光谱、热重-差热、X射线衍射和电化学分析,明确了热解碳泡沫为半导体材料,其热解残余基团无序区造成的阈值效应、共轭效应和位阻效应抑制π电子离域移动,控制载流子浓度,进而影响热解碳泡沫材料的电磁性能。对不同温度热解碳泡沫材料电磁参数的测试表明,600~700℃热解的碳泡沫材料的介电常数实部和虚部大小适合,适合作吸波材料。In order to avoid using polymer as basis materials and further expand the application of carbon-based absorbing materials in space or simulated space environments,a new idea for preparing pyrolytic carbon foam absorbing materials by the precast body method combined with pyrolysis process was proposed in this work.A series of pyrolytic carbon foams were prepared at different target pyrolysis temperatures ranging from 400℃to 1500℃.Through the analysis of Fourier infrared spectrum(FTIR),thermogravimetric and differential scanning calorimetry(TG-DSC),X-ray diffraction(XRD)and electrochemistry of the pyrolytic carbon foam materials at different temperatures,it is confirmed that the pyrolytic carbon foam is a semiconductor material.The threshold,conjugation and site resistance effects caused by the pyrolytic residual functional groups and their disordered region inhibitπ-electron off-domain mobility and control the carrier concentration,which in turn affect the electromagnetic properties of pyrolytic carbon foam materials.The electromagnetic parameters of carbon foam materials at different pyrolytic temperatures show that the pyrolytic carbon foam materials at 600℃to 700℃are suitable for use as absorbing materials.

关 键 词：碳泡沫吸波材料 热解 半导体 空间环境 热真空 

分 类 号：TB34[一般工业技术—材料科学与工程]