Surface Metallization of Glass Fiber(GF)/Polyetheretherketone(PEEK) Composite with Cu Coatings Deposited by Magnetron Sputtering and Electroplating  

作　　者：钟利 金凡亚 朱剑豪 TONG Honghui DAN Min ZHONG Li;JIN Fanya;CHU Paul K;TONG Honghui;DAN Min(Southwest Institute of Physics,Chengdu 610000,China;City University of Hong Kong,Tat Chee Avenue,Kowloon,Hong Kong 999077,China)

机构地区：[1]Southwest Institute of Physics,Chengdu 610000,China [2]City University of Hong Kong,Tat Chee Avenue,Kowloon,Hong Kong 999077,China

出　　处：《Journal of Wuhan University of Technology(Materials Science)》2024年第1期213-220,共8页武汉理工大学学报（材料科学英文版）

基　　金：Funded by Shenzhen-Hong Kong Innovative Collaborative Research and Development Program (Nos.SGLH20181109 110802117, CityU 9240014);Innovation Project of Southwestern Institute of Physics (Nos.202001XWCXYD002, 202301XWCX003);CNNC Young Talent Program (No.2023JZYF-01)。

摘　　要：Surface metallization of glass fiber(GF)/polyetheretherketone(PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction(XRD), scanning electron microscopy(SEM), and electron backscatter diffraction(EBSD).The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998.The results show that the Cu coating with a thickness of 30 μm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress,bonding strength, and electrical conductivity than the Cu coating deposited by electroplating.

关 键 词：surface metallization Cu coating magnetron sputtering ELECTROPLATING 

分 类 号：TB332[一般工业技术—材料科学与工程]