中温固化导热抗冲击环氧灌封胶性能研究  

Study on properties of thermal conduction and impact resistance epoxy potting adhesive curing at medium temperature

作　　者：冯朝波 黎灿光 王祥伟 娄星原 陈建军 Feng Chaobo;Li Canguang;Wang Xiangwei;Lou Xingyuan;Chen Jianjun(Guangzhou Baiyun Technology Co.,Ltd.,Guangzhou 510540,Guangdong,China)

机构地区：[1]广州白云科技股份有限公司,广东广州510540

出　　处：《中国胶粘剂》2023年第12期28-32,60,共6页China Adhesives

摘　　要：以环氧树脂、增韧剂、导热填料、阻燃剂、酸酐固化剂及助剂为主要原料,制备了环氧灌封胶,并对其性能进行表征。研究结果表明:(1)综合考虑冲击强度及耐热性,复配增韧剂添加量8%~12%较合适。(2)综合考虑黏度及施工性能等,优选m(球形氮化铝)∶m(片状氮化硼)=3∶1的复配导热粉,且复配导热粉添加25%~30%较合适。(3)随着环氧灌封胶在沸水中浸泡时间的增加,起初吸水率快速增加,之后吸水率缓慢增加直至饱和。沸水浸泡1 h吸水率小于0.3%,满足SJ/T 11125—1997电子元器件用环氧系灌封材料行业标准要求。(4)采用优选的梯度固化工艺(70℃,1 h;95℃,1 h),灌封胶上、下层密度和导热性能差异小,固化物内应力均一,高低温循环后无裂纹。(5)该环氧导热灌封胶混合黏度低,可操作时间长,具有良好的灌封浸渍性能,可适应全自动化点胶设备的要求。Epoxy potting adhesive was prepared by using epoxy resin,toughening agent,thermal conductive filler,flame retardant,anhydride curing agent and additives as main raw materials,and its properties were characterized.The research results showed that,(1)Considering the impact strength and heat resistance comprehensively,it was more appropriate to add 8%to 12%of the compound toughening agent(.2)Considering the viscosity and construction performance comprehensively,the compound thermal conductive powders with the ratio of m(spherical aluminum nitride)to m(flake boron nitride)=3∶1 were selected,it was more suitable to add 25%to 30%of the compound thermal conductive powders.(3)As the soaking time of epoxy potting adhesive in boiling water increased,the initial water absorption rate increased rapidly,and then the water absorption rate slowly increased until saturation.The water absorption rate after soaking in boiling water for 1 hour was less than 0.3%,which met the industry standard requirements of SJ/T 11125—1997 encapsulation materials of epoxy series for use in electronic components.(4)Using the optimal gradient curing process(70℃,1 hour;95℃,1 hour),the upper and lower density and thermal conductivity of potting adhesive had little difference,the internal stress of the cured material was uniform,and there were no cracks after high and low temperature cycling(.5)This thermal conductive epoxy potting adhesive had low mixing viscosity,long operating time,and good potting and impregnation performance,which could meet the requirements of fully automated dispensing equipment.

关 键 词：环氧灌封胶 冲击强度 导热系数 热变形温度 吸水率 

分 类 号：TQ436.6[化学工程]