国产聚酰亚胺柔性覆铜板材料介电性能测评  

Measurement and Evaluation of Dielectric Properties of Domestic Polyimide Flexible Copper-clad Laminate Materials

作　　者：吴军[1] 赵攀 WU Jun;ZHAO Pan(The 10th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第十研究所,成都610036

出　　处：《电子工艺技术》2024年第1期39-42,共4页Electronics Process Technology

基　　金：科工局材料科研项目。

摘　　要：介绍了聚酰亚胺柔性覆铜板的主要电性能指标及其典型应用场景,明确了柔性覆铜板介电性能测评流程。在完成谐振环仿真及设计后,开展ASG-TL00060UF2国产高性能聚酰亚胺柔性覆铜板与进口板材的常温和湿热试验,进行介电性能对比测试计算。最后给出了国产聚酰亚胺柔性覆铜板材料介电性能测评结论。The main electrical properties and typical application scenarios of polyimideflexible copper-clad laminate are introduced,and the dielectric performance evaluation process of flexible copper-clad plate is defined.After completing the simulation and design of the resonance ring,the room temperature and humid heat tests of ASG-TL00060UF2 domestic high-performance polyimide flexible copper-clad plate and imported plate are carried out,the dielectric performance are compared and calculated.Finally,the dielectric performance of domestic polyimideflexible copper clad plate material are evaluated.

关 键 词：聚酰亚胺 柔性覆铜板 介电常数 介电损耗 

分 类 号：TN606[电子电信—电路与系统]