一种超低温用中温固化环氧树脂基体的研究与性能表征  

Study and Performance Characterization of a Moderate Temperature Curing Epoxy Resin Matrix Used in Cryogenic Circumstance

作　　者：周红霞[1] 王冠[1] 付刚[1] 吴鑫锐 高堂铃[1] 吴健伟[1] ZHOU Hongxia;WANG Guan;FU Gang;WU Xinrui;GAO Tangling;WU Jianwei(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China;Shanghai Composite Materials Technology Co.,Ltd.,Shanghai 201100,China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040 [2]上海复合材料科技有限公司,上海201100

出　　处：《化学与粘合》2024年第1期10-15,共6页Chemistry and Adhesion

基　　金：哈尔滨市创新人才基金项目从事高性能树脂的研究(编号:2023-RS-02)。

摘　　要：采用聚酚氧和POSS体(笼型倍半硅氧烷)为原料制备了纳米增韧粒子MPKHH(改性聚酚氧)并自制了促进剂M,将MPKHH、双氰胺固化剂和促进剂M通过熔融共混的方式改性了环氧树脂(EP),制备得到超低温环境用中温固化改性环氧树脂基体(MEPK)。研究结果表明:MPKHH不改变反应路径,且通过半互穿网络(SIPN)的增韧机理改善EP树脂的韧性。含有10%(wt)MPKHH的EP混合物在-196℃下的冲击强度约为18.1 kJ/m2,并且模量维持在3.5 GPa左右,经30次冷-热循环后(-196~150℃),试样表面未见裂纹产生。The modified phenoxy resin nano-particle(MPKHH)is synthesized with phenoxy resin(PKHH)and silsesquioxane(POSS),and the accelerator M is also prepared.The method of melt blending is used to modify the EP with MPKHH,curing agent dicyandiamide and accelerator M to prepare the moderate temperature curing EP matrix(MEPK)which can be apply in the cryogenic environment.The results show that the reaction pathways of EP resin are not changed and the toughness of EP resin is enhanced by the mechanism of semi-interpenetrating network(SIPN)with the addition of MPKHH.Especially,the impact strength value of MEPK blends with the content of 10%(wt)MPKHH is measured to be 18.1 kJ/m2 and the modulus maintains at about 3.5 GPa at-196℃,there are no cracks on the surface of sample after 30 times of hot-cold cycles(-196~150℃).

关 键 词：中温固化 聚酚氧 环氧树脂 超低温 增韧 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]