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作 者:张敏[1] 张珂[1] 杨鹏云 ZHANG Min;ZHANG Ke;YANG Pengyun(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)
机构地区:[1]中国电子科技集团公司第十二研究所,北京100015
出 处:《太赫兹科学与电子信息学报》2024年第1期17-21,共5页Journal of Terahertz Science and Electronic Information Technology
摘 要:为满足太赫兹真空器件对阴极的大电流密度、小电子注尺寸需求,利用双离子束辅助沉积技术在浸渍钪酸盐阴极表面沉积Ta/Zr抑制膜,并利用聚焦离子束刻蚀技术制备出发射面直径为100μm的微型热阴极。在此基础之上着重研究这种阴极的抑制膜特性,研究表明,Ta/Zr膜层比Zr膜层临界附着力更强,双离子束辅助沉积制备的Ta/Zr抑制膜比磁控溅射制备的Ta/Zr抑制膜更加致密,并且抑制发射寿命更长。阴极良好的抑制效果一方面是因为Ba扩散至Zr中形成高功函数物质,另一方面是因为Ta/Zr复合膜层高度致密有效抑制了Ba的扩散。In order to meet the demand of THz vacuum devices for miniature electron beam with high current density,a kind of miniature cathode has been prepared by depositing Ta/Zr coating on impregnated scandate cathode surface via dual Ion-Beam-Assisted Deposition(Dual IBAD)and etching an emission zone with a diameter of 100 m via Focus Ion Beam(FIB).Based on the previous study,this paper focuses on the characteristics of anti-emission coating.It is shown in the experimental results that Ta/Zr coating prepared by dual Ion Beam Assisted Deposition(Dual IBAD)can suppress electron emission more effectively and has a longer life time than that prepared by magnetron sputtering.The reasons for the sound anti-emission performance are that composition with high work function is formed in the process of Barium diffusion into the Ta/Zr coating,and that Barium diffusion is effectively suppressed by the high dense Ta/Zr coating.
关 键 词:太赫兹器件 微型阴极 双离子束沉积 Ta/Zr抑制膜
分 类 号:TN103[电子电信—物理电子学]
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