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作 者:肖治理 杨琳[1] XIAO Zhili;YANG Lin(College of Materials Science and Engineering,Taiyuan University of Technology,Taiyuan 030024,China)
机构地区:[1]太原理工大学材料科学与工程学院,山西太原030024
出 处:《热加工工艺》2023年第20期71-75,共5页Hot Working Technology
基 金:国家自然科学基金资助项目(51402206)。
摘 要:采用化学气相沉积法在多孔泡沫铜基体表面原位生成石墨烯,然后通过冷压烧结和二次冷轧、退火的工艺制备石墨烯增强铜基复合材料。研究表明,采用化学气相沉积的方法在铜基体表面原位生成石墨烯可以提高制备的复合材料的抗拉强度以及使其保持较高的导电率。二次轧制退火后石墨烯增强铜基复合材料的相对密度达到98.96%,经测试复合材料的导电率高达88.7%IACS,其抗拉强度达到了289.5 MPa较同实验条件制备的纯铜提高32.98%。The graphene was generated in situ on the surface of porous copper foam matrix by chemical vapor deposition,and then graphene-reinforced copper matrix composites were prepared by cold pressing sintering and secondary cold rolling and annealing processes.The results show that the in-situ generation of graphene on the surface of copper matrix by chemical vapor deposition can improve the tensile strength and maintain the high conductivity of the prepared composites.The relative density of the graphene-reinforced copper matrix composite reaches 98.96%after secondary rolling and annealing,and the conductivity of the composite is tested to be as high as 88.7%IACS,and its tensile strength reachs 289.5 MPa which is 32.98%higher than that of the pure copper prepared under the same experimental conditions.
分 类 号:TB333.12[一般工业技术—材料科学与工程]
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