高导电高耐热铜合金及铜基复合材料的研究现状与展望  

Research Status and Prospects for High-Conductivity and High Heat-Resistance Copper Alloys and Copper Matrix Composites

作　　者：王佳睿 张翔 何春年[1] 赵乃勤[1] WANG Jiarui;ZHANG Xiang;HE Chunnian;ZHAO Naiqin(School of Materials Science and Engineering,Tianjin University,Tianjin 300350,China)

机构地区：[1]天津大学材料科学与工程学院,天津300350

出　　处：《铸造技术》2024年第1期1-26,共26页Foundry Technology

基　　金：国家自然科学基金(52371013,520712230)。

摘　　要：高导耐热铜基材料作为现代高新技术用关键材料之一,已被广泛应用于轨道交通、电子通信和航空航天等领域。本文从铜合金和铜基复合材料两大领域入手,介绍了常见高导耐热铜材料的设计思路、制备方法、微观组织结构、力学性能和物理性能,并对其导电机制和高温强化机理进行了归纳和阐释,最后对高导耐热铜基材料的研究现状和未来发展进行了总结与展望。As key materials for modern advanced technology,copper-based materials with high conductivity and heat resistance have been widely used in many fields,such as rail transportation,electronic communications and aerospace.In this work,the design,preparation methods,microstructure,and mechanical and physical properties of common copper materials with high conductivity and heat resistance are introduced from the two major fields of copper alloys and copper matrix composites.In addition,the conductivity mechanism and high-temperature strengthening mechanism of the materials are summarized and explained.Finally,the research status and future development of copper materials with high conductivity and heat resistance are summarized and prospected.

关 键 词：高电导率 高耐热性 铜合金 铜基复合材料 导电机制 高温强化机理 

分 类 号：TG146.1[一般工业技术—材料科学与工程]