基于FPGA的FLASH存储器三温功能测试系统设计  

Design of FPGA-based three-temperature functional testing system for FLASH memory

作　　者：侯晓宇 郭贺 常艳昭 HOU Xiaoyu;GUO He;CHANG Yanzhao(China Electronic Technology Group Corporation No.58 Research Institute,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《现代电子技术》2024年第4期39-42,共4页Modern Electronics Technique

摘　　要：由于大容量FLASH存储器全地址功能测试时间较长,在自动化测试设备(ATE)上进行高低温测试时,长时间使用热流罩会导致测试设备运行异常。为把存储器测试过程中耗时最长的全地址功能测试部分从ATE机台上分离出来,设计一个基于FPGA的驱动板卡,结合MSCAN和Checkerboard算法实现了对被测芯片激励信号的施加;然后,设计一个12工位的驱动板卡,实现了在三温条件下的多芯片同步测试;接着,设计一个基于Qt的上位机软件,实现了对测试结果的实时显示与存储;最后,对2 GB大容量FLASH存储器进行测试验证。测试结果表明,与传统的ATE测试相比,基于驱动板和工位板的测试系统可实现对大容量FLASH的全地址功能的高低温测试,且工位板具有的高可扩展性可实现多芯片的同步测试,大幅提高了测试效率。Due to the long testing time for the full address function of high-capacity FLASH memory,prolonged use of heat flow hoods during high and low temperature testing on automatic test equipment(ATE)can cause abnormal operation of the testing equipment.In order to separate the full-address functional test part with longest time consumption in the the memory testing process from the ATE equipment,an FPGA-based driver board is designed,and the application of excitation signals to the tested chip is achieved by combining MSCAN and Checkerboard algorithms.A 12 sites driver board is designed to realize the multichip synchronous testing under the three-temperature condition.A Qt based upper computer software is designed to realize real-time display and storage of testing results.The testing and verification for the 2 GB large-capacity FLASH memory are conducted.The testing results show that in comparison with the traditional ATE test,the testing system based on driver board and the site board can realize high and low temperature testing for full address functionality of high-capacity FLASH,and the high scalability of site boards can achieve synchronous testing of multiple chips,greatly improving testing efficiency.

关 键 词：FPGA FLASH存储器 三温测试 自动化测试设备 MSCAN 多工位测试 

分 类 号：TN307-34[电子电信—物理电子学]