材料搭配及叠层结构对混压PCB可靠性的影响研究  

The influence of material collocation and laminated structure on hybrid lamination PCB's reliability

作　　者：唐海波 李逸林 张志远 TANG Haibo;LI Yilin;ZHANG Zhiyuan(Shenyi Electronics Co.,Ltd.,Dongguan 523127,Guangdong,China)

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2024年第1期10-14,共5页Printed Circuit Information

基　　金：东莞市重点领域研发项目(20201200300022)。

摘　　要：通过简化的混压可靠性测试模型,研究了一种典型的极低损耗、超低损耗材料与中损耗、高Tg的FR-4材料之间的混压情况。对比在不同的叠层设计和材料搭配条件下的可靠性差异,找出了叠层设计中材料搭配的各关键因子对可靠性的影响规律,对混压技术的提升具有积极的意义。Through a simplified hybrid printed circuit board(PCB) reliability test model,this paper studies the hybird between our typical very low loss materials,ultra low loss materials,and middle loss,high Tg FR4 materials,compares the reliability difference under different laminated design and material collocation conditions,and finds out the influence law of various key factors of material collocation in laminated design on the reliability,which has positive meaning for hybrid PCB technology.

关 键 词：高速材料 混压 叠层设计 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]