薄膜复合粘接工艺的PID控制优化分析  

Optimization analysis of PID control for thin film composite bonding process

作　　者：赵向杰 尹培丽[2] ZHAO Xiangjie;YIN Peili(Xi’an Aeronautical Polytechnic Institute,Xi’an 710089,China;Xi’an Technological University,Xi’an 710021,China)

机构地区：[1]西安航空职业技术学院,陕西西安710089 [2]西安工业大学,陕西西安710021

出　　处：《粘接》2024年第2期9-12,共4页Adhesion

基　　金：陕西省“十四五”教育科学规划2022年度课题(项目编号:SGH22Y1621);西安航空职业技术学院科研课题(项目编号:20XHSK-05)。

摘　　要：为块状物薄膜复合粘接工艺提供精确可靠的控制方案,根据不同薄膜复合粘接工艺进行分析得到电机控制特征,并与传统的控制方法进行控制效率对比,对茶砖薄膜复合粘接的步骤加以确定并使用PLC实现粘接系统控制,通过PID策略分析和MATLAB仿真后,选择得到块状物粘接控制方案,粘接过程中的各阶段的阶跃响应曲线,下料时间有效缩短为其定重时间的80%以上,并缩短原有下料时间25%-34%。通过使用合适的PID控制方案有效地优化了原有粘接工艺,为实际应用于相关生产过程中提供科学的理论支持。Based on the PID control strategy of traditional PID and BP neural network and the software and hardware design,it provides an accurate and reliable control scheme for the similar block film composite bonding process.Taking the film composite bonding process of tea bricks as an example,the motor control characteristics are obtained according to the different film composite bonding processes,and the control efficiency is compared with the traditional control method.On the basis of the establishment of the control scheme,the steps of composite bonding of tea brick film are determined and PLC is used to control the bonding system.Finally,the stages of the whole bonding process are calculated and the benign evaluation of the whole process is finally realized.After PID strategy analysis and MATLAB simulation,the neural network PID control strategy is appropriately selected as the block bonding control scheme,and the step response curve of each stage in the bonding process is obtained,and the feeding time is effectively shortened to more than 80%of the fixing time,and the original feeding time is shortened by 25%-34%.The original bonding process was effectively optimized by using the appropriate PID control scheme,providing scientific theoretical support for the practical application in the related production process and laying a foundation for the subsequent research.

关 键 词：块状物粘接 PID控制策略 软硬件设计 阶跃响应曲线 

分 类 号：TB486[一般工业技术—包装工程] TQ320.73[化学工程—合成树脂塑料工业]