基于空间设计的5089结构胶改性制备与应用策略研究  

Research on the preparation and application strategy of 5089 structural adhesive modification based on spatial design

作　　者：谢蕾 孔英琪 遆素丽 XIE Lei;KONG Yingqi;DI Suli(Wenzhou Business College,Wenzhou 325035,Zhejiang China)

机构地区：[1]温州商学院,浙江温州325035

出　　处：《粘接》2024年第2期58-61,共4页Adhesion

摘　　要：基于环境空间设计需要,对空间设计用5089胶粘剂进行了改性处理,对比分析了3种不同改性胶粘剂的动态热机械分析曲线和玻璃化转变温度-固化温度关系曲线。结果表明,与改性胶粘剂A相比,相同固化温度下改性胶粘剂B和改性胶粘剂C的储能模量都相对较高,且在固化温度为100~130℃时,改性胶粘剂A、改性胶粘剂B和改性胶粘剂C都兼具弹性和粘性;耐热性从高至低顺序依次为改性胶粘剂B、改性胶粘剂C、改性胶粘剂A,且改性胶粘剂B在固化温度100、110和130℃时的玻璃化转变温度都高于原始5089胶粘剂,表明改性胶粘剂B在此温度下的胶接接头耐热性能都优于原始5089胶粘剂。Based on the needs of environmental space design,5089 adhesives for space design were modified,and the dynamic thermal mechanical analysis curves and glass transition temperature curing temperature relationship curves of three different modified adhesives were compared and analyzed.The results showed that compared with modified adhesive A,the energy storage modulus of modified adhesive B and modified adhesive C were relatively higher at the same curing temperature,and when the curing temperature was between 100℃and 130℃,modified adhesive A,modified adhesive B and modified adhesive C all had elasticity and viscosity;The order of heat resistance of modified adhesives from high to low was:modified adhesive B,modified adhesive C and modified adhesive A,and the glass transition temperature of modified adhesive B at curing temperatures of 100℃,110℃,and 130℃was higher than that of the original 5089 adhesive,indicating that the heat resistance of adhesive joints of modified adhesive B at this temperature was better than that of the original 5089 adhesive.

关 键 词：环境空间设计 胶粘剂 改性 动态热机械分析曲线 耐热性能 

分 类 号：TQ436.2[化学工程]