KDP晶体微塑性域增强金刚石切削方法研究  

Research on the Method of KDP Crystal by Diamond Turning in Micro-Ductile Domain

作　　者：李兆中 岳晓斌[1] 阳红[1] LI Zhao-zhong;YUE Xiao-bin;YANG Hong(Institute of Machinery Manufacturing Technology,CAEP,Sichuan Mianyang 621900,China)

机构地区：[1]中国工程物理研究院机械制造工艺研究所,四川绵阳621900

出　　处：《机械设计与制造》2024年第2期116-118,124,共4页Machinery Design & Manufacture

基　　金：国家自然科学基金(51305413);四川省科技计划项目(2021YJ0051);中国工程物理研究院院长基金资助(YZJJLX2020006)。

摘　　要：针对KDP在SPDT切削过程中容易产生凹坑、划痕、裂纹等表面缺陷问题,提出利用热激励的方式增大KDP晶体塑性切削域深度,降低各向异性、机床运动误差、环境振动等因素对加工过程的影响,进而提高SPDT切削加工过程稳定性的方法。通过纳米压痕试验获得了KDP晶体表面在不同温度状态下的硬度和脆塑性转变深度变化规律,并在SPDT机床上采用金刚石刀具开展了KDP晶体飞切划痕实验,进一步验证了适当提高KDP晶体温度可以增大KDP晶体脆塑性转变临界切削深度。在此基础上,对KDP晶体开展了不同温度状态下的切削实验,实验结果表明在相同工艺参数下,随着温度的升高,表面粗糙度Sa值从3.2nm降低至1.6nm。To solve the problem of surface defects such as pits,scratches and cracks in single point diamond turning process of KDP crystal,a thermal excitation method is proposed to improve the stability of SPDT process.This method can increase ductile cutting domain depth of KDP crystal,and reduce the influence of anisotropy,machine tool's motion error,environmental vibration and other factors on turning process.Through the nanoindentation test,the hardness and the brittle ductile transition depth of the KDP crystal surface under different temperature states are obtained.The fly-cutting scratch experiment on SPDT machine tools with diamond tools verifies that increasing the KDP crystal temperature appropriately can increase the critical cutting depth of KDP crystal's brittle ductile transition.Moreover,cutting experiments on KDP crystals at different temperatures show that under the same cutting parameters,with the increase of temperature,the surface roughness Sa decreases from 3.2nm to 1.6nm.

关 键 词：KDP晶体 热激励 金刚石切削 微塑性域 

分 类 号：TH16[机械工程—机械制造及自动化] TH145.1[一般工业技术—材料科学与工程] TG519.3[机械工程—精密仪器及机械]