电动汽车功率电子封装用耐高温环氧塑封料的研究进展  

Research progress on high temperature resistant epoxy molding compounds for power electronic packaging in electrical vehicles

作　　者：王晓蕾 张有生 戴晟伟 柳宇昂 杜萱哲 任茜 刘金刚[1] WANG Xiaolei;ZHANG Yousheng;DAI Shengwei;LIU Yuang;DU Xuanzhe;REN Xi;LIU Jingang(Engineering Research Center of Ministry of Education for Geological Carbon Storage and Low Carbon Utilization of Resources,School of Materials Science and Technology,China University of Geosciences,Beijing 100083,China;Zhejiang Jameen New Material Co.,Ltd.,Jiaxing 314011,China)

机构地区：[1]中国地质大学(北京)材料科学与工程学院地质碳储与资源低碳利用教育部工程研究中心,北京100083 [2]浙江嘉民新材料有限公司,浙江嘉兴314011

出　　处：《绝缘材料》2024年第1期9-17,共9页Insulating Materials

基　　金：深圳市科技计划项目(JSGG20210629144539012)。

摘　　要：本文综述了近年来国内外关于耐高温环氧塑封料(EMC)的基础研究与应用进展,从先进功率电子器件发展对塑封材料的性能需求、传统EMC的高温降解机理、EMC结构与耐热稳定性的关系以及提高EMC耐热稳定性的改性途径等方面进行了阐述。重点综述了多芳环(MAR)型以及含萘型EMC的发展状况。最后对功率电子封装用耐高温EMC未来的发展趋势进行了展望。In this paper,the basic research and application progress of high temperature resistant epoxy molding compound(EMC)at home and abroad in recent years were reviewed.The property requirements of advanced power electronics on the molding compound,the high temperature degradation mechanism of traditional EMC,the relationship between structure and thermal stability of EMC,and the modification pathways for improving the thermal stability of EMC were presented.Especially,the development status of multi-aromatic ring(MAR)and naphthalene-containing EMC were reviewed.At last,the future development trends of high temperature resistant EMC for power electronic packaging were prospected.

关 键 词：功率电子封装 环氧塑封料 耐高温 环氧树脂 酚醛树脂 

分 类 号：TM215.1[一般工业技术—材料科学与工程]