FPC用改性丙烯酸酯胶粘剂的固化研究  

Study on curing of modified acrylate adhesive for FPC

作　　者：陈伟[1,2] 陈文求 余洋[1,2] 张雪平 李桢林 范和平[1,2,3] Chen Wei;Chen Wenqiu;Yu Yang;Zhang Xueping;Li Zhenlin;Fan Heping(HAISO Technology Co.,Ltd.,Wuhan 430074,Hubei,China;HAISO EM(Wuhan)Ltd.,Wuhan 430074,Hubei,China;Hubei Research Institute of Chemistry,Jianghan University,Wuhan 430056,Hubei,China)

机构地区：[1]华烁科技股份有限公司,湖北武汉430074 [2]华烁电子材料(武汉)有限公司,湖北武汉430074 [3]江汉大学湖北省化学研究院,湖北武汉430056

出　　处：《中国胶粘剂》2024年第1期16-20,49,共6页China Adhesives

基　　金：湖北省科技发展专项(42000023205T000000146);江汉大学光电化学材料与器件教育部重点实验室开放课题基金(JDGD-202028)。

摘　　要：改性丙烯酸酯类胶粘剂应用于挠性印制电路板(FPC)及其基材时,其固化程度对性能有着决定性的影响。本文以自制的环氧树脂改性的丙烯酸酯类胶粘剂为例,通过动态差示扫描量热仪(DSC)从理论上分析其非等温固化的动力学行为,以研究其在室温时的储存稳定性和高温固化的工艺条件。然后通过傅里叶变换红外光谱仪(FT-IR)研究其在室温以及125~300℃温度范围内的固化反应历程,以保证该胶粘剂应用于FPC的热固性胶膜/片的固化性能或效果。研究结果表明:(1)通过非等温DSC测试,确定了改性丙烯酸酯胶粘剂的固化动力学方程,由此推算其在10~50℃的常规储存温度下的反应速率常数K值低至10^(-5) min^(-1)级别及以下,具有优异的B阶稳定性;同时在180℃及以上的K值达到10^(-1) min^(-1)级别,可以满足其高温烘烤迅速固化的使用要求。(2)由动态DSC测试得到的三种特征温度,进而推算本胶膜的理论固化温度为182℃,且在此温度下实现100%固化需时约100 min,并通过DSC测试进行了验证。(3)通过FT-IR对比验证了以上高温固化的反应历程,其在200℃处理后环氧基基本反应完全,这与以上分析的结果一致。When modified acrylate adhesive was applied to flexible printed circuit board(FPC)and its substrates,the degree of curing had a decisive influence on the performance.In this paper,taking the self-made epoxy resin modified acrylate adhesive as an example,the kinetic behavior of its non-isothermal curing was analyzed theoretically by dynamic differential scanning calorimetry(DSC),in order to study its storage stability at room temperature and the process conditions of high temperature curing.Then,its curing reaction process at room temperature and the temperature range of 125-300℃was investigated by Fourier transform infrared spectroscopy(FT-IR)to ensure the curing performance or effect of the adhesive applied to the thermosetting adhesive film/sheet of FPC.The research results show that,(1)The curing kinetics equation of the modified acrylate adhesive was determined by non-isothermal DSC test,from which it was deduced that its reaction rate constant K value was as low as the 10^(-5) min^(−1) level and below under the conventional storage temperature of 10-50℃,exhibiting excellent B-order stability.At the same time,the K value at 180℃and above reached the 10^(-1) min^(−1) level,which could meet the requirements of rapid curing by high temperature baking.(2)Based on three characteristic temperatures obtained from the dynamic DSC test,the theoretical curing temperature of this adhesive film was calculated to be 182℃,and it took about 100 min to realize 100%curing at this temperature,which was verified by DSC test.(3)The reaction process of the above high temperature curing was verified by FT-IR comparison,and the epoxy group was basically reacted completely after treatment at 200℃,which was consistent with the results of the above analysis.

关 键 词：改性丙烯酸酯 胶粘剂 固化 性能 挠性印制电路板 

分 类 号：TQ433[化学工程]