数据驱动的焊膏印刷工艺参数推荐技术  

Recommended Technology for Solder Paste Printing Process Parameters on Data Driven

作　　者：苏欣 SU Xin(School of Automotive Engineering,Chengdu Aeronautic Polytechnic,Chengdu 610100,China)

机构地区：[1]成都航空职业技术学院汽车工程学院,四川成都610100

出　　处：《计算机与现代化》2024年第1期99-102,116,共5页Computer and Modernization

摘　　要：针对印制板焊膏印刷过程中工艺参数制定主观性大、经验依赖性强的问题,提出一种数据驱动的印刷工艺参数推荐方法。首先构建面向每一元器件焊膏印刷质量预测模型,包括面向每一元器件的印刷合格率预测、焊膏相对面积/体积预测、印刷缺陷类型预测3个子模型;其次以每一元器件印刷质量最优为目标,构建印制板焊膏印刷工艺参数推荐模型;最后基于实际印制板的印刷数据中对各模型的正确性进行验证,印刷合格率预测的平均准确度达到98%,推荐出的工艺参数的偏差值与经验值的偏差小于10%,质量预测和工艺参数推荐结果均可满足实际生产应用要求。Aiming at the problems of subjectivity and strong dependence on experience in the process of solder paste printing of printed boards,a way to recommend printing process parameters on data driven method is proposed.Firstly,the prediction mod els of component solder paste printing quality for each component is constructed,which concluded three sub models for each component:printing qualification rate prediction,solder paste relative area/volume prediction,and printing defect type predic tion.Then,the recommended model of solder paste printing process parameters for printed board is structure aiming to optimize the printing quality of each component.Finally,the correctness of the models were verified based on the actual printing data,the average accuracy of the prediction of the printing qualification rate reached 99%,the deviation between the recommended pro cess parameters and the empirical value was less than 10%.All these means the results of quality prediction and process param eter recommendation can meet the requirements of practical production and application.

关 键 词：焊膏印刷 随机森林 质量预测 参数推荐 

分 类 号：TN605[电子电信—电路与系统]