胶接铝合金界面断裂韧性试验及数值研究  

Experimental and Numerical Study of Interfacial Fracture Toughness in Adhesive Bonded Aluminum Alloy

作　　者：赵宏宇 田世伟 李龙飞 侯得锋 李海彬[1] ZHAO Hongyu;TIAN Shiwei;LI Longfei;HOU Defeng;LI Haibin(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2023年第6期74-81,共8页Equipment for Electronic Products Manufacturing

摘　　要：胶层脱粘问题是金属胶接结构承载性能评估的重要工作之一,其中的关键问题在于如何准确地测定I型界面断裂韧性。结合数字图像相关技术,定义了一种新的名义裂尖,以此来确定裂纹扩展长度。在此基础上,开展了铝合金I型界面断裂韧性的测定试验,得到了断裂韧性数值。采用有限元数值方法,对铝合金I型界面扩展行为进行了有限元仿真,试验和数值结果吻合良好,证明了试验和数值方法的有效性。胶层界面断裂韧性的研究对精密光学仪器加工制造中胶接结构的力学性能评估具有指导意义。The problem of adhesive layer debonding is one of the important tasks in the load-bearing capacity evaluation of metal bonded structures,and the key is how to accurately determine the mode I fracture toughness.A new nominal crack tip is defined based on digital image correlation techniques to determine the crack propagation length in this paper.On this basis,the test of mode I interfacial fracture toughness of aluminum alloy is carried out,and the fracture toughness value is obtained.The finite element numerical method is used to simulate the mode I interface expansion behavior of aluminum alloy,and the experimental results agree well with the numerical results,which proves the validity of the experimental and numerical methods.The research in this paper is of guiding significance to the evaluation of mechanical properties of metal bonded structures in the manufacture of precision optical instruments.

关 键 词：内聚力模型 I型断裂韧性 铝合金 数字图像 

分 类 号：TN304.05[电子电信—物理电子学]