EDTA对氯化胆碱-乙二醇低共熔溶剂中铜电沉积行为的影响  

Effect of EDTA on electrodeposition behavior of copper in choline chloride-ethylene glycol deep eutectic solvent

作　　者：张司琪 徐铭孝 毕铭雪 孙海静 孙杰[1] ZHANG Siqi;XU Mingxiao;BI Mingxue;SUN Haijing;SUN Jie(School of Environmental and Chemical Engineering,Shenyang Ligong University,Shenyang 110159,China)

机构地区：[1]沈阳理工大学环境与化学工程学院,辽宁沈阳110159

出　　处：《电镀与涂饰》2023年第24期1-7,共7页Electroplating & Finishing

基　　金：沈阳理工大学高水平成果建设项目(SYLUXM202105);沈阳理工大学科研创新团队支持项目(SYLUTD202004);水改性低共熔溶剂中Zn–Ni合金的可控制备及电沉积机理研究(LJKMZ20220598)。

摘　　要：分别采用紫外-可见分光光度法(UV-Vis)、循环伏安法(CV)、计时电流法(CA)、扫描电子显微镜(SEM)和X射线衍射(XRD)等技术,研究了乙二胺四乙酸(EDTA)对铜在氯化胆碱-乙二醇(Ch Cl-EG)低共熔溶剂中的电化学行为,不同电位阶跃下的电结晶机理,以及对铜镀层微观形貌和物相组成的影响。结果表明,EDTA的加入导致溶液中配合物形式发生了转变,[Cu Cl4]2-中的Cl-被EDTA取代,使铜物种更加稳定。EDTA的加入不会影响铜的成核方式,但会导致铜镀层的微观形貌发生变化,由大块不规则颗粒变为均匀细小的球状结构,使铜镀层更加均匀致密。The effect of ethylenediaminetetraacetic acid(EDTA)on the electrochemical behavior of copper in choline chloride-ethylene glycol(ChCl-EG)deep eutectic solvent(DES)and the electrocrystallization mechanism of copper under different potential steps as well as on the micromorphology and phase composition of copper deposit was studied by ultraviolet-visible spectrophotometry(UV),cyclic voltammetry(CV),chronoamperometry(CA),scanning electron microscopy(SEM),and X-ray diffraction(XRD)techniques.The results showed that the addition of EDTA led to a change in the form of copper complexes in the DES.The Cl−in[CuCl4]2−was replaced by EDTA,making the copper species more stable.The addition of EDTA did not affect the nucleation mode of copper,but made the micromorphology of copper deposit from a large and irregular particulate structure to a uniform and fine spherical one.

关 键 词：铜 电沉积 低共熔溶剂 乙二胺四乙酸 微观结构 成核 机理 

分 类 号：TQ153[化学工程—电化学工业]