低介质损耗乙烯基树脂材料的制备与性能  

Preparation and Properties of Low Dielectric Loss Vinyl Resin Materials

作　　者：张坤 邹静 周友 唐安斌[1,2] ZHANG Kun;ZOU Jing;ZHOU You;TANG Anbin(School of Materials and Chemistry,Southwest University of Science and Technology,Mianyang 621010,Sichuan,China;Sichuan EM Technology Co.LTD,Mianyang 621000,Sichuan,China)

机构地区：[1]西南科技大学材料与化学学院,四川绵阳621010 [2]四川东材科技集团股份有限公司,四川绵阳621000

出　　处：《华东理工大学学报（自然科学版）》2024年第1期30-35,共6页Journal of East China University of Science and Technology

基　　金：四川省科技成果转移转化示范项目(23ZHSF0344);绵阳市科技项目(2021JSGG002)。

摘　　要：使用双酚A(BPA)和4-乙烯基苄氯(VBC)为原料合成一种双酚A型乙烯基苄基醚(VLBPA)树脂,采用高效液相色谱、红外光谱分析和核磁共振氢谱表征方法,确定了产物结构,探究了产物的最优合成条件。在145℃/1.5 h+175℃/2 h+210℃/4h固化条件下制备VLBPA固化物,并测试了其热学性能和介电性能。结果表明,产物的最优合成条件为:n(BPA)∶n(VBC)∶n(NaOH)=1.0∶2.8∶2.4,反应时间7 h,该条件下产物产率可达到92.76%。差示扫描量热(DSC)分析结果表明,VLBPA在117.7℃时存在融化的吸热峰,在156.3℃时存在乙烯基的交联放热峰。树脂固化物在N_2气氛下5%热失重温度(T_(5%))达到了400.5℃,具有良好的热稳定性能;在频率10 GHz下,介电常数(D_k)为2.79,介质损耗(D_f)为0.006 5。To meet the challenges brought by the rapid development of modern communication technology,new resin materials need to be developed for copper clad laminate(CCL)which could be applied in order to achieve better performance in high-frequency applications.In this work,a vinyl resin(VLBPA)was prepared by Williamson etherification of bisphenol A(BPA)and 4-vinyl benzyl chloride(VBC).The structure and properties of VLBPA were characterized by HPLC,1H-NMR,FT-IR and differential scanning calorimetry(DSC),and the optimal synthesis condition of the product was studied.Then the cured VLBPA resin was prepared by vacuum hot compression moulding at following preparation method:VLBPA resin was compressed at 145℃for 1.5 h,then the temperature was raised to 175℃for 2 h,followed by 210℃for 4 h.The thermal stability and dielectric properties of the cured VLBPA resins were analyzed by thermogravimetric analysis(TGA)and dielectric spectrometer.The results show that an optimized yield of VLBPA can be achieved when n(BPA)∶n(VBC)∶n(NaOH)is 1.0∶2.8∶2.4,which is 92.76%.DSC analysis results show that the melting point of VLBPA is 117.7°C and the crosslinking of vinyl groups happens at the temperature of 156.3°C.The TGA results indicate that the 5%weight loss temperature of the cured resins under nitrogen atmosphere is 400.5℃.Dielectric property tests of cured resin were performed at 10 GHz condition.The average value of the dielectric constant(Dk)and the dielectric loss(Df)is 2.79 and 0.0065,respectively.

关 键 词：乙烯基树脂 合成条件 热固化 热学性能 介电性能 

分 类 号：O632.13[理学—高分子化学]