基于多目标模板匹配的晶圆芯片检测方法  

Wafer Detection Method Based on Multi-object Template Matching

作　　者：高德傲 陈晓荣[1] 张驰艺 祖赫阳 顾徐镕 董宏杰 王元吉 GAO Deao;CHEN Xiaorong;ZHANG Chiyi;ZU Heyang;GU Xurong;DONG Hongjie;WANG Yuanji(School of Optoelectronic Information and Computer Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China)

机构地区：[1]上海理工大学光电信息与计算机工程学院,上海200093

出　　处：《软件导刊》2024年第2期146-152,共7页Software Guide

基　　金：国家自然科学基金面上项目(52175513)

摘　　要：晶圆芯片检测在晶圆加工生产过程中起着至关重要的作用。针对工业生产过程中晶圆芯片检测耗时长、精度低的局限性,提出一种基于机器视觉的结合非极大值抑制算法的改进多目标模板匹配算法。该算法利用近邻外接矩形算法得到最贴合芯片的矩形轮廓,精准获取矩形芯片的模板;对于影响模板匹配的芯片表面污染,则采用结合形态学改进的灰度补偿方法,以降低污染区域灰度值对匹配结果的影响。实验结果表明,所提多目标模板匹配算法的识别率在95%以上,耗时不超过0.5 s;近邻外接矩形算法比传统的最小外接矩形算法更精准,为工业晶圆芯片检测提供可行方案。Wafer chip detection plays a crucial role in the wafer processing and production process.To address the limitations of long time and low accuracy in wafer chip detection in industrial production processes,an improved multi-objective template matching algorithm based on machine vision combined with non maximum suppression algorithm is proposed.This algorithm utilizes the nearest neighbor bounding rectan⁃gle algorithm to obtain the rectangular contour that best fits the chip,accurately obtaining the template of the rectangular chip;For chip sur⁃face contamination that affects template matching,a grayscale compensation method combined with morphological improvement is adopted to reduce the impact of grayscale values in the contaminated area on the matching results.The experimental results show that the recognition rate of the proposed multi-objective template matching algorithm is over 95%,and the time consumption does not exceed 0.5 seconds;The nearest neighbor bounding rectangle algorithm is more accurate than the traditional minimum bounding rectangle algorithm,providing a feasible solu⁃tion for industrial wafer chip detection.

关 键 词：晶圆芯片检测 机器视觉 非极大值抑制 多目标模板匹配 近邻外接矩形 灰度补偿 

分 类 号：TP391.41[自动化与计算机技术—计算机应用技术]