Ag72Cu钎焊阻焊技术研究  

Study on Brazing Resistance Welding Technology of Ag72Cu

作　　者：赵飞[1,2] 何素珍 于辰伟[1,2] 张玉君 ZHAO Fei;HE Suzhen;YU Chenwei;ZHANG Yujun(The 43th Research Institute of China Electronics Technology Group Corporation,Hefei,230088,CHN;Hefei Shengda Electronics Technology Industry Co.,Ltd.,Hefei,230088,CHN)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088 [2]合肥圣达电子科技实业有限公司,合肥230088

出　　处：《固体电子学研究与进展》2023年第6期547-551,共5页Research & Progress of SSE

摘　　要：以某功率放大器金属封装外壳为研究对象,运用微观组织分析方法,对氮化铝和氧化铝两种不同的陶瓷粉体浆料构成的阻焊层的阻焊结构进行了分析。氮化铝阻焊浆料由于其内部组织颗粒之间比较松散且有孔洞,与基体结合力不强,阻焊效果差。氧化铝浆料阻焊层具有结构致密度更高、与基体结合力更强等特点,阻焊效果良好,采用其制备的阻焊层可满足芯片摩擦焊区域不允许出现焊料流淌的要求,实现Ag72Cu硬钎焊阻焊的目的。Taking the metal packaging shell of a power amplifier as the research object,the mi⁃crostructure analysis method was used to analyze the resistance welding structure of the resistance welding layer composed of two different ceramic powder pastes,aluminum nitride and aluminum ox⁃ide.Aluminum nitride solder paste has poor solder resistance due to its loose and porous internal struc⁃ture particles,weak adhesion to the substrate,and poor solder resistance effect.The aluminum oxide slurry solder mask layer has the characteristics of higher structural density and stronger bonding force with the substrate,and has good solder mask effect.The solder mask layer prepared by the aluminum oxide slurry can meet the requirement of no solder flow in the chip friction welding area,achieving the purpose of Ag72Cu brazing solder mask.

关 键 词：金属封装外壳 阻焊浆料 硬钎焊 摩擦焊 

分 类 号：TN605[电子电信—电路与系统]