面向电动汽车功率芯片封装应用的耐高温塑封料研究进展  

Progress on high temperature resistant molding compounds for packaging of power chips in electrical vehicles

作　　者：王晓蕾 张有生 戴晟伟 韩淑军 齐悦新 任茜 刘金刚[1] WANG Xiaolei;ZHANG Yousheng;DAI Shengwei;HAN Shujun;QI Yuexin;REN Xi;LIU Jingang(Engineering Research Center of Ministry of Education for Geological Carbon Storage and Low Carbon Utilization of Resources,School of Materials Science and Technology,China University of Geosciences,Beijing 100083,China;Zhejiang Jameen New Material Co.,Ltd.,Jiaxing 314011,China)

机构地区：[1]中国地质大学(北京)材料科学与工程学院地质碳储与资源低碳利用教育部工程研究中心,北京100083 [2]浙江嘉民新材料有限公司,浙江嘉兴314011

出　　处：《绝缘材料》2024年第2期1-9,共9页Insulating Materials

基　　金：深圳市科技计划项目(技术攻关重点项目)(JSGG20210629144539012)。

摘　　要：环氧塑封料(EMC)在电动汽车电控系统用芯片封装中扮演着重要角色。电动汽车电控系统工作温度的不断升高对传统EMC材料的耐热稳定性提出了越来越高的要求。本文综述了国内外近年来在耐高温塑封料领域的研究进展,从耐高温树脂发展概况及其对传统环氧树脂基EMC材料的改性进展等方面进行了阐述。重点综述了双马来酰亚胺(BMI)、氰酸酯(CE)、聚苯并噁嗪(PBZ)树脂改性EMC材料以及邻苯二腈基塑封料的发展状况。最后对电动汽车电控芯片封装用耐高温塑封料的未来发展趋势进行了展望。Epoxy molding compounds(EMC)play important roles in packaging of chips for electrically controlling systems of electric vehicles(EV).The increasing working temperature of EV controlling system puts forward higher and higher requirements for the thermal stability of traditional EMC materials.In this paper,the progress on the high temperature resistant molding compounds at home and abroad in recent years was reviewed,and the development status of high temperature resistant resins and the progress of high temperature resistant resins modified traditional epoxy resin based EMC materials were described.Especially,the development status of high temperature resistant EMC materials modified by bismaleimide(BMI),cyanate ester(CE),and polybenzoxazine(PBZ)and phthalonitrile(PN)based molding compounds were reviewed.Finally,the future development trend of high temperature resistant molding compounds for packaging of electronic control chip in EV was prospected.

关 键 词：功率电子封装 环氧塑封料 双马来酰亚胺 氰酸酯 聚苯并噁嗪 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ323.5[电气工程—电工理论与新技术]