W-Cu复合材料的应用现状及掺杂改性的研究进展  

Application Status and Research Progress of Doping Modification of W-Cu Composites

作　　者：娄文鹏 李秀青 魏世忠 王琪 梁菁琨 陈良栋 徐流杰 LOU Wen-peng;LI Xiu-qing;WEI Shi-zhong;WAN GQi;LIANG Jing-kun;CHEN Liang-dong;XU Liu-jie(School of Materials Science&Engineering,Henan University of Science and Technology,Luoyang 471023,China;National and Local Joint Engineering Research Center for Abrasion Control and Molding of Metal Materials,Luoyang 471023,China;Henan International Joint Laboratory for High Temperature Refractory Metal Materials,Luoyang 471023,China)

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]金属材料磨损控制与成型技术国家地方联合研究中心,河南洛阳471023 [3]河南省高温难熔金属材料国际联合实验室,河南洛阳471023

出　　处：《稀有金属与硬质合金》2024年第1期6-16,共11页Rare Metals and Cemented Carbides

基　　金：国家自然科学基金项目(U2004180);河南省科技攻关项目(232102230059);龙门实验室前沿探索项目(LMQYTSKT001);河南科技大学青年骨干教师培养计划项目(13450023)。

摘　　要：W-Cu复合材料因具有高的硬度、耐磨性、抗烧蚀性能、导电性和导热性以及低热膨胀系数等综合性能而被广泛应用于多种工业领域。本文介绍了W-Cu复合材料的最新研究进展及其在电触头、微电子、军事、功能梯度材料方面的应用现状,着重总结和分析了目前W-Cu复合材料掺杂改性的分类及原理,以及掺杂改性对材料性能的影响,最后提出了W-Cu复合材料未来发展的潜在问题和值得关注的研究方向。W-Cu composites are widely used in various industrial fields due to their excellent comprehensive properties, including high hardness, wear resistance, ablation resistance, electrical and thermal conductivity, and low thermal expansion coefficient.This paper introduces the latest research progress of W-Cu compo-sites and their current applications in electrical contacts, microelectronics, military use, and functionally graded materials.In addtion, the paper emphatically summarizes and analyzes the classification and principles of doping modification for W-Cu composites, as well as the influence of doping modification on material properties.Finally, the potential problems and research directions of W-Cu composites in the future are put forward.

关 键 词：W-CU复合材料 掺杂改性 钨铜互溶性 应用现状 性能 

分 类 号：TG146.11[一般工业技术—材料科学与工程]