高温无铅电子封装技术研究进展  

Research Advance in High-temperature Lead-free Electronic Packaging Technology

作　　者：俞铄城 YU Shuocheng(School of Electronic Science and Engineering,Nanjing University,Nanjing,210023,CHN)

机构地区：[1]南京大学电子科学与工程学院,南京210023

出　　处：《固体电子学研究与进展》2024年第1期84-91,共8页Research & Progress of SSE

基　　金：江苏省重点研发计划产业前瞻与关键核心技术项目(BE2022070-4)。

摘　　要：针对当前高温功率芯片耐高温封装连接问题,评述了国内外新型无铅高温焊料、纳米颗粒烧结技术、瞬时液相连接和瞬时液相烧结(Transient liquid phase sintering, TLPS)技术的研究现状和动态,分析了各种技术的优缺点。分析发现纳米颗粒材料和TLPS连接技术应用于高温器件封装时具有低温连接、高温服役的显著优势。但纳米颗粒材料烧结过程中存在有机物难以挥发、Cu纳米颗粒易被氧化、Ag纳米颗粒接头中的电迁移等问题;TLPS烧结过程中由于有机粘结剂的挥发以及颗粒物体积收缩,致使接头产生孔洞,导致接头的电导率和热导率降低。这些问题可以通过合金元素的添加、工艺的改进,以及焊料的复合化加以解决,这将推动高温电子封装行业的发展。This article addresses the issue of high-temperature packaging and interconnection for current high-temperature power chips.It reviews the research status and trends of novel lead-free high-temperature solder materials,nano-sintering technology,transient liquid phase bonding,and transient liquid phase sintering(TLPS)connections both domestically and internationally.The advantages and disadvantages of various technologies are analyzed.Analysis has found that the application of nanoparticle materials and TLPS connection technology to high-temperature device packaging has significant advantages in low-temperature connection and high-temperature service.However,during the sintering process of nanoparticle materials,organic matter is difficult to volatilize,Cu nanoparticles are easily oxidized,and Ag nanoparticle joints have problems such as electromigration.During the TLPS sintering process,due to the volatilization of organic binders and the volume shrinkage of particles,holes are produced in the joint,leading to a reduction in the electrical conductivity and thermal conductivity of the joint.These problems can be solved by adding alloy elements,improving the process,and compounding the solder,which will promote the development of the high-temperature electronic packaging industry.

关 键 词：高温无铅焊料 纳米颗粒烧结 瞬态液相连接 瞬态液相烧结 

分 类 号：TN05[电子电信—物理电子学]