电镀线对陶瓷外壳传输性能的影响研究  

Research on the Effect of Electroplating Line on the Transmission Performance of Ceramic Package

作　　者：程理丽[1] CHENG Lili(No.54 Research Institute of CETC,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第五十四研究所,河北石家庄050051

出　　处：《电子质量》2023年第12期60-64,共5页Electronics Quality

摘　　要：为了实现陶瓷外壳表面图形的电镀,需要在信号线的基础上引入辅助电镀线。基于高温共烧陶瓷(HTCC)技术制作带电镀线的陶瓷外壳,通过仿真软件分析了不同长度、宽度的电镀线和电镀线的位置对信号线传输性能的影响。研究结果表明,随着电镀线的增长,信号线的阻抗减小,传输性能急剧下降。电镀线的宽度对信号线的传输性能几乎没有影响。通过该研究,掌握了电镀线对陶瓷外壳信号线传输性能的影响程度,可较快设计同类陶瓷外壳,满足不同用户的需求。In order to realize the electroplating of the surface pattern of the ceramic housing,it is necessary to introduce auxiliary electroplating lines on the basis of the signal lines.Based on the high temperature co-fired ceramics(HTCC)technology,the ceramic package with electroplating lines is fabricated,and the effects of different lengths and widths of electroplating lines and the position of electroplating lines on the transmission performance of signal lines are analyzed by simulation software.The research results show that with the increase of the plating line,the impedance of the signal line decreases,and the transmission performance drops sharply.The width of the plated line has little effect on the transmission performance of the signal line.Through the research,the degree of influence of the electroplating line on the transmission performance of the ceramic package signal line can be mastered,and the similar ceramic package can be designed quickly to meet the needs of different users.

关 键 词：电镀线 陶瓷封装外壳 信号线 传输性能 仿真 

分 类 号：TP391.99[自动化与计算机技术—计算机应用技术]