金刚石线锯电火花复合切割硬脆半导体的研究进展  

Research progress of diamond wire saw electrical discharge composite sawing of hard-brittle semiconductors

作　　者：张乃军 高玉飞 郭志田 ZHANG Naijun;GAO Yufei;GUO Zhitian(Key Laboratory of High Efficiency and Clean Mechanical Manufacture of Ministry of Education,School of Mechanical Engineering,Shandong University,Jinan 250061,CHN;Qingte Group Co.,Ltd.,Qingdao 266000,CHN)

机构地区：[1]山东大学机械工程学院高效洁净机械制造教育部重点实验室,山东济南250061 [2]青特集团有限公司,山东青岛266000

出　　处：《制造技术与机床》2024年第3期69-75,共7页Manufacturing Technology & Machine Tool

基　　金：国家自然科学基金(51875322);山东省自然科学基金项目(ZR2023ME145)。

摘　　要：太阳能光伏产业和电子工业的迅速发展对使用的晶体硅等硬脆半导体材料的切割提出了更高的要求。为了进一步提高硬脆半导体的切割加工质量和生产效率、降低生产成本,金刚石线锯电火花复合切割技术开始被应用到硬脆半导体的切割中。文章从加工原理、工艺性能和影响因素等方面综述了金刚石线锯电火花复合切割硬脆半导体材料的研究现状,并对后续的发展和研究方向进行了展望。The rapid development of the solar photovoltaic and the electronics industry has put forward higher requirements for the cutting of hard-brittle semiconductor materials such as crystalline silicon.To further improve the cutting quality and production efficiency of hard and brittle semiconductors and reduce the production cost,diamond wire saw electrical discharge composite sawing has been applied to hard and brittle semiconductor cutting.In this paper,the research progress of this composite sawing technology of hard and brittle semiconductor materials is reviewed from the processing principle,process performance and influencing factors,and the future development and research direction are prospected.

关 键 词：金刚石线锯电火花复合切割 硬脆半导体 加工机理 

分 类 号：TG661[金属学及工艺—金属切削加工及机床]